Rosch; Jonathan L.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Rosch; Jonathan L..The latest application filed is for "device and method of very high density routing used with embedded multi-die interconnect bridge".
- Rosch; Jonathan L. - Mesa AZ
| Patent | Date |
|---|---|
| Device And Method Of Very High Density Routing Used With Embedded Multi-die Interconnect Bridge App 20210280517 - May; Robert Alan ; et al. | 2021-09-09 |
| Plated through hole socketing coupled to a solder ball to engage with a pin Grant 10,741,947 - Alur , et al. A | 2020-08-11 |
| Multi-packaging for single-socketing Grant 10,734,358 - Rosch , et al. | 2020-08-04 |
| Multi-layer solder resists for semiconductor device package surfaces and methods of assembling same Grant 10,535,590 - Rosch Ja | 2020-01-14 |
| Multi-packaging For Single-socketing App 20190385979 - Rosch; Jonathan L. ; et al. | 2019-12-19 |
| Plated Through Hole Socketing App 20190214751 - Alur; Amruthavalli Pallavi ; et al. | 2019-07-11 |
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