Patent applications and USPTO patent grants for Roper; David.The latest application filed is for "leaded package integrated circuit stacking".
Patent | Date |
---|---|
Modified core for circuit module system and method Grant 7,760,513 - Partridge , et al. July 20, 2 | 2010-07-20 |
Stacked module systems and method Grant 7,323,364 - Partridge , et al. January 29, 2 | 2008-01-29 |
Leaded Package Integrated Circuit Stacking App 20070257349 - Wehrly; James Douglas JR. ;   et al. | 2007-11-08 |
Leaded package integrated circuit stacking Grant 7,259,452 - Wehrly, Jr. , et al. August 21, 2 | 2007-08-21 |
Leaded package integrated circuit stacking App 20070080470 - Wehrly; James Douglas JR. ;   et al. | 2007-04-12 |
Stacked module systems and method App 20060263938 - Partridge; Julian ;   et al. | 2006-11-23 |
Modified core for circuit module system and method App 20060198238 - Partridge; Julian ;   et al. | 2006-09-07 |
Flexible circuit connector for stacked chip module Grant 7,066,741 - Burns , et al. June 27, 2 | 2006-06-27 |
Circuit module component mounting system and method App 20060118936 - Rapport; Russell ;   et al. | 2006-06-08 |
Stacked module systems and method Grant 7,033,861 - Partridge , et al. April 25, 2 | 2006-04-25 |
Flexible circuit connector for stacked chip module App 20030203663 - Burns, Carmen D. ;   et al. | 2003-10-30 |
Flexible circuit connector for stacked chip module Grant 6,572,387 - Burns , et al. June 3, 2 | 2003-06-03 |
Flexible circuit connector for stacked chip module App 20020102870 - Burns, Carmen D. ;   et al. | 2002-08-01 |
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