name:-0.0098750591278076
name:-0.009188175201416
name:-0.00042486190795898
Roper; David Patent Filings

Roper; David

Patent Applications and Registrations

Patent applications and USPTO patent grants for Roper; David.The latest application filed is for "leaded package integrated circuit stacking".

Company Profile
0.6.7
  • Roper; David - Austin TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
Modified core for circuit module system and method
Grant 7,760,513 - Partridge , et al. July 20, 2
2010-07-20
Stacked module systems and method
Grant 7,323,364 - Partridge , et al. January 29, 2
2008-01-29
Leaded Package Integrated Circuit Stacking
App 20070257349 - Wehrly; James Douglas JR. ;   et al.
2007-11-08
Leaded package integrated circuit stacking
Grant 7,259,452 - Wehrly, Jr. , et al. August 21, 2
2007-08-21
Leaded package integrated circuit stacking
App 20070080470 - Wehrly; James Douglas JR. ;   et al.
2007-04-12
Stacked module systems and method
App 20060263938 - Partridge; Julian ;   et al.
2006-11-23
Modified core for circuit module system and method
App 20060198238 - Partridge; Julian ;   et al.
2006-09-07
Flexible circuit connector for stacked chip module
Grant 7,066,741 - Burns , et al. June 27, 2
2006-06-27
Circuit module component mounting system and method
App 20060118936 - Rapport; Russell ;   et al.
2006-06-08
Stacked module systems and method
Grant 7,033,861 - Partridge , et al. April 25, 2
2006-04-25
Flexible circuit connector for stacked chip module
App 20030203663 - Burns, Carmen D. ;   et al.
2003-10-30
Flexible circuit connector for stacked chip module
Grant 6,572,387 - Burns , et al. June 3, 2
2003-06-03
Flexible circuit connector for stacked chip module
App 20020102870 - Burns, Carmen D. ;   et al.
2002-08-01

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