Roop; Raymond M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Roop; Raymond M..The latest application filed is for "sensing field effect transistor devices, systems in which they are incorporated, and methods of their fabrication".

Company Profile

0.22.16

Roop; Raymond M. - Scottsdale AZ
Roop; Raymond M. - Paradise Valley AZ US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sensing field effect transistor devices, systems in which they are incorporated, and methods of their fabrication Grant 10,107,779 - Roop , et al. October 23, 2	2018-10-23
Sensing Field Effect Transistor Devices, Systems In Which They Are Incorporated, And Methods Of Their Fabrication App 20180188203 - ROOP; Raymond M. ; et al.	2018-07-05
Sensing field effect transistor devices, systems in which they are incorporated, and methods of their fabrication Grant 9,927,392 - Roop , et al. March 27, 2	2018-03-27
Protected sensor field effect transistors Grant 9,857,329 - Parris , et al. January 2, 2	2018-01-02
Protected Sensor Field Effect Transistors App 20160370314 - Parris; Patrice M. ; et al.	2016-12-22
Protected Sensor Field Effect Transistors App 20160356740 - Parris; Patrice M. ; et al.	2016-12-08
Protected sensor field effect transistors Grant 9,494,550 - Parris , et al. November 15, 2	2016-11-15
Sensing field effect transistor devices and method of their manufacture Grant 9,470,652 - Hooper , et al. October 18, 2	2016-10-18
Sensing Field Effect Transistor Devices, Systems In Which They Are Incorporated, And Methods Of Their Fabrication App 20160047775 - ROOP; RAYMOND M. ; et al.	2016-02-18
Sensor packaging method and sensor packages Grant 9,165,886 - Bowles , et al. October 20, 2	2015-10-20
Sensor package and method of forming same Grant 9,040,355 - Bowles , et al. May 26, 2	2015-05-26
Vent hole sealing in multiple die sensor device Grant 9,018,029 - Bowles , et al. April 28, 2	2015-04-28
Sensor Package And Method Of Forming Same App 20150048462 - BOWLES; PHILIP H. ; et al.	2015-02-19
Sensor Packaging Method And Sensor Packages App 20140124958 - Bowles; Philip H. ; et al.	2014-05-08
Sensor Packaging Method And Sensor Packages App 20140061948 - Bowles; Philip H. ; et al.	2014-03-06
Sensor packaging method and sensor packages Grant 8,659,167 - Bowles , et al. February 25, 2	2014-02-25
Sensor Package And Method Of Forming Same App 20140015123 - Bowles; Philip H. ; et al.	2014-01-16
Method of forming a seal for a semiconductor device Grant 7,585,744 - Gogoi , et al. September 8, 2	2009-09-08
Method for forming a semiconductor structure through epitaxial growth Grant 6,916,728 - Gogoi , et al. July 12, 2	2005-07-12
Method of forming a seal for a semiconductor device App 20050124089 - Gogoi, Bishnu P. ; et al.	2005-06-09
Semiconductor structure and method of manufacture App 20040119125 - Gogoi, Bishnu ; et al.	2004-06-24
Electronic component Grant 6,720,635 - Koch , et al. April 13, 2	2004-04-13
Microprocessor having environmental sensing capability Grant 5,291,607 - Ristic , et al. March 1, 1	1994-03-01
Monolithic circuit with integrated bulk structure resonator Grant 5,260,596 - Dunn , et al. November 9, 1	1993-11-09
Low voltage, deep junction device and method Grant 5,141,887 - Liaw , et al. August 25, 1	1992-08-25
Semiconductor devices with improved turn-off characteristics Grant 4,047,218 - Clark , et al. September 6, 1	1977-09-06

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