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name:-0.02344012260437
name:-0.0076661109924316
name:-0.004364013671875
Rondon; Michael J. Patent Filings

Rondon; Michael J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rondon; Michael J..The latest application filed is for "indium electroplating on physical vapor deposition tantalum".

Company Profile
2.3.5
  • Rondon; Michael J. - Santa Rosa CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Iterative formation of damascene interconnects
Grant 11,430,753 - Miller , et al. August 30, 2
2022-08-30
Semiconductor device with aluminum nitride anti-deflection layer
Grant 11,410,937 - Clarke , et al. August 9, 2
2022-08-09
Indium Electroplating On Physical Vapor Deposition Tantalum
App 20220154359 - Rondon; Michael J. ;   et al.
2022-05-19
Iterative Formation Of Damascene Interconnects
App 20220013478 - Miller; Eric R. ;   et al.
2022-01-13
Ultraviolet Radiation Shield Layer
App 20220013399 - Rondon; Michael J. ;   et al.
2022-01-13
Semiconductor Device With Aluminum Nitride Anti-deflection Layer
App 20210280531 - Clarke; Andrew P. ;   et al.
2021-09-09
Semiconductor device with anti-deflection layers
Grant 10,515,905 - Rondon , et al. Dec
2019-12-24
Semiconductor Device With Anti-deflection Layers
App 20190385954 - Rondon; Michael J. ;   et al.
2019-12-19

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