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Patent applications and USPTO patent grants for Rondon; Michael J..The latest application filed is for "indium electroplating on physical vapor deposition tantalum".
Patent | Date |
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Iterative formation of damascene interconnects Grant 11,430,753 - Miller , et al. August 30, 2 | 2022-08-30 |
Semiconductor device with aluminum nitride anti-deflection layer Grant 11,410,937 - Clarke , et al. August 9, 2 | 2022-08-09 |
Indium Electroplating On Physical Vapor Deposition Tantalum App 20220154359 - Rondon; Michael J. ;   et al. | 2022-05-19 |
Iterative Formation Of Damascene Interconnects App 20220013478 - Miller; Eric R. ;   et al. | 2022-01-13 |
Ultraviolet Radiation Shield Layer App 20220013399 - Rondon; Michael J. ;   et al. | 2022-01-13 |
Semiconductor Device With Aluminum Nitride Anti-deflection Layer App 20210280531 - Clarke; Andrew P. ;   et al. | 2021-09-09 |
Semiconductor device with anti-deflection layers Grant 10,515,905 - Rondon , et al. Dec | 2019-12-24 |
Semiconductor Device With Anti-deflection Layers App 20190385954 - Rondon; Michael J. ;   et al. | 2019-12-19 |
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