Romm; Douglas W

Patent Applications and Registrations

Patent applications and USPTO patent grants for Romm; Douglas W.The latest application filed is for "palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication".

Company Profile

0.9.6

Romm; Douglas W - Sherman TX
Romm; Douglas W. - Sherman TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication Grant 7,939,378 - Abbott , et al. May 10, 2	2011-05-10
Palladium-Spot Leadframes for High Adhesion Semiconductor Devices and Method of Fabrication App 20070243665 - Abbott; Donald C. ; et al.	2007-10-18
Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication Grant 7,245,006 - Abbott , et al. July 17, 2	2007-07-17
Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin Grant 7,064,008 - Abbott , et al. June 20, 2	2006-06-20
Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication App 20060001132 - Abbott; Donald C. ; et al.	2006-01-05
Leadframes for high adhesion semiconductor devices and method of fabrication Grant 6,953,986 - Abbott , et al. October 11, 2	2005-10-11
Electrical apparatus having resistance to atmospheric effects and method of manufacture therefor Grant 6,849,806 - Abbott , et al. February 1, 2	2005-02-01
Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin App 20040183165 - Abbott, Donald C. ; et al.	2004-09-23
Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin Grant 6,713,852 - Abbott , et al. March 30, 2	2004-03-30
Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin App 20030146497 - Abbott, Donald C. ; et al.	2003-08-07
Thin tin preplated semiconductor leadframes Grant 6,583,500 - Abbott , et al. June 24, 2	2003-06-24
Electrical apparatus having resistance to atmospheric effects and method of manufacture therefor App 20030094689 - Abbott, Donald C. ; et al.	2003-05-22
Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication App 20020070434 - Abbott, Donald C. ; et al.	2002-06-13
Composite connection structure and method of manufacturing Grant 6,337,445 - Abbott , et al. January 8, 2	2002-01-08
Quick cure exhaust manifold Grant 5,444,923 - Romm , et al. August 29, 1	1995-08-29

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