| Patent | Date |
|---|
Methods, Apparatus, And Systems To Facilitate Multi-channel Isolation
App 20210294302 - Romig; Matthew David ; et al. | 2021-09-23 |
Multi-chip Module Leadless Package
App 20210257282 - Romig; Matthew David ; et al. | 2021-08-19 |
3D-printed protective shell structures with support columns for stress sensitive circuits
Grant 11,082,028 - Wainerdi , et al. August 3, 2 | 2021-08-03 |
Methods, apparatus, and systems to facilitate multi-channel isolation
Grant 11,061,384 - Romig , et al. July 13, 2 | 2021-07-13 |
Bond wire support systems and methods
Grant 11,049,836 - Romig , et al. June 29, 2 | 2021-06-29 |
Integrated Circuit Package for Isolation Dies
App 20210175326 - Romig; Matthew David ; et al. | 2021-06-10 |
Methods, Apparatus, And Systems To Facilitate Multi-channel Isolation
App 20210157299 - Romig; Matthew David ; et al. | 2021-05-27 |
Packaged semiconductor system having unidirectional connections to discrete components
Grant 10,756,013 - Gandhi , et al. A | 2020-08-25 |
Packaged Semiconductor System Having Unidirectional Connections To Discrete Components
App 20200185323 - Gandhi; Saumya ; et al. | 2020-06-11 |
3d Printing Of Protective Shell Structures For Stress Sensitive Circuits
App 20200127637 - Wainerdi; James Cooper ; et al. | 2020-04-23 |
Packaged semiconductor system having unidirectional connections to discrete components
Grant 10,566,276 - Gandhi , et al. Feb | 2020-02-18 |
3D-printed protective shell structures for stress sensitive circuits
Grant 10,516,381 - Wainerdi , et al. Dec | 2019-12-24 |
Thermistor Die-based Thermal Probe
App 20190346312 - ROMIG; MATTHEW DAVID ; et al. | 2019-11-14 |
Bond Wire Support Systems And Methods
App 20190326247 - ROMIG; MATTHEW DAVID ; et al. | 2019-10-24 |
3d Printing Of Protective Shell Structures For Stress Sensitive Circuits
App 20190207582 - WAINERDI; James Cooper ; et al. | 2019-07-04 |
Packaged Semiconductor System Having Unidirectional Connections To Discrete Components
App 20190139883 - Gandhi; Saumya ; et al. | 2019-05-09 |
Discrete device mounted on substrate
Grant 9,899,339 - Romig , et al. February 20, 2 | 2018-02-20 |
High-frequency Antenna Structure With High Thermal Conductivity And High Surface Area
App 20170347490 - Romig; Matthew David ; et al. | 2017-11-30 |
Packaged device with additive substrate surface modification
Grant 9,780,017 - Cook , et al. October 3, 2 | 2017-10-03 |
Integrated power package
Grant 9,768,130 - Romig , et al. September 19, 2 | 2017-09-19 |
Printed interconnects for semiconductor packages
Grant 9,679,864 - Cook , et al. June 13, 2 | 2017-06-13 |
Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide
Grant 9,647,329 - Herbsommer , et al. May 9, 2 | 2017-05-09 |
Integrated Power Package
App 20170117238 - Romig; Matthew David ; et al. | 2017-04-27 |
Packaged Device with Additive Substrate Surface Modification
App 20170053854 - Cook; Benjamin Stassen ; et al. | 2017-02-23 |
Printed Interconnects For Semiconductor Packages
App 20170033072 - Cook; Benjamin Stassen ; et al. | 2017-02-02 |
Integrated circuit package and method
Grant 9,527,728 - Romig , et al. December 27, 2 | 2016-12-27 |
Packaged device with additive substrate surface modification
Grant 9,524,926 - Cook , et al. December 20, 2 | 2016-12-20 |
Printed interconnects for semiconductor packages
Grant 9,496,171 - Cook , et al. November 15, 2 | 2016-11-15 |
Integrated Circuit Package Method
App 20160096727 - Romig; Matthew David ; et al. | 2016-04-07 |
Packaged Device With Additive Substrate Surface Modification
App 20160093558 - COOK; BENJAMIN STASSEN ; et al. | 2016-03-31 |
Printed Interconnects For Semiconductor Packages
App 20160093525 - COOK; BENJAMIN STASSEN ; et al. | 2016-03-31 |
Encapsulated Molded Package with Embedded Antenna for High Data Rate Communication Using a Dielectric Waveguide
App 20150295305 - Herbsommer; Juan Alejandro ; et al. | 2015-10-15 |
Integrated circuit package with printed circuit layer
Grant 9,111,845 - Romig , et al. August 18, 2 | 2015-08-18 |
Electronic assembly with three dimensional inkjet printed traces
Grant 8,945,986 - Romig , et al. February 3, 2 | 2015-02-03 |
Integrated Circuit Package And Method
App 20150021721 - Romig; Matthew David ; et al. | 2015-01-22 |
Integrated Circuit Package With Printed Circuit Layer
App 20140361402 - Romig; Matthew David ; et al. | 2014-12-11 |
Integrated circuit package with printed circuit layer
Grant 8,847,349 - Romig , et al. September 30, 2 | 2014-09-30 |
Electronic assembly with three dimensional inkjet printed traces
Grant 8,816,513 - Romig , et al. August 26, 2 | 2014-08-26 |
Integrated Circuit Package With Printed Circuit Layer
App 20140175599 - Romig; Matthew David ; et al. | 2014-06-26 |
Electronic Assembly with Three Dimensional Inkjet Printed Traces
App 20140127856 - Romig; Matthew David ; et al. | 2014-05-08 |
Discrete Device Mounted On Substrate
App 20140124939 - Romig; Matthew David ; et al. | 2014-05-08 |
Electronic Assembly With Three Dimensional Inkjet Printed Traces
App 20140054795 - Romig; Matthew David ; et al. | 2014-02-27 |
Apparatus for Connecting Integrated Circuit Chip to Power and Ground Circuits
App 20110070700 - ROMIG; Matthew David | 2011-03-24 |
Apparatus for connecting integrated circuit chip to power and ground circuits
Grant 7,863,738 - Romig January 4, 2 | 2011-01-04 |
Wafer Chip Scale Package With Center Conductive Mass
App 20100289145 - Chipalkatti; Jayprakash Vijay ; et al. | 2010-11-18 |
Apparatus for connecting integrated circuit chip to power and ground circuits
App 20080284010 - Romig; Matthew David | 2008-11-20 |
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