Rolston; Kevin C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rolston; Kevin C..The latest application filed is for "electronic module for motherboard".

Company Profile

2.11.9

Rolston; Kevin C. - Westchester CA
Rolston; Kevin C. - Playa Del Rey CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic module for motherboard Grant 11,195,779 - Brown , et al. December 7, 2	2021-12-07
Electronic Module For Motherboard App 20210043542 - Brown; Michael Benjamin ; et al.	2021-02-11
Tile for an active electronically scanned array (AESA) Grant 10,541,461 - Teshiba , et al. Ja	2020-01-21
Tile For An Active Electronically Scanned Array (aesa) App 20180175476 - Teshiba; Mary A. ; et al.	2018-06-21
Multi-layer microwave corrugated printed circuit board and method Grant 9,491,854 - Quan , et al. November 8, 2	2016-11-08
Process for fabricating a three dimensional molded feed structure Grant 9,072,164 - Viscarra , et al. June 30, 2	2015-06-30
Multi-layer Microwave Corrugated Printed Circuit Board And Method App 20130319732 - Quan; Clifton ; et al.	2013-12-05
Process for forming channels in a flexible circuit substrate using an elongated wedge and a channel shaped receptacle Grant 8,453,314 - Viscarra , et al. June 4, 2	2013-06-04
Adhesive reinforced open hole interconnect Grant 8,354,595 - Rolston , et al. January 15, 2	2013-01-15
Process For Fabricating An Origami Formed Antenna Radiating Structure App 20120137505 - Viscarra; Alberto F. ; et al.	2012-06-07
Process for fabricating an origami formed antenna radiating structure Grant 8,127,432 - Viscarra , et al. March 6, 2	2012-03-06
Adhesive Reinforced Open Hole Interconnect App 20110261539 - Rolston; Kevin C. ; et al.	2011-10-27
Process For Fabricating An Origami Formed Antenna Radiating Structure App 20110113618 - Viscarra; Alberto F. ; et al.	2011-05-19
Process For Fabricating A Three Dimensional Molded Feed Structure App 20110113619 - Viscarra; Alberto F. ; et al.	2011-05-19
Multi-layer Microwave Corrugated Printed Circuit Board And Method App 20110024160 - Quan; Clifton ; et al.	2011-02-03
Circuit board assembly and method of attaching a chip to a circuit board with a fillet bond not covering RF traces Grant 7,298,235 - Hauhe , et al. November 20, 2	2007-11-20
Circuit board assembly and method of attaching a chip to a circuit board App 20050151215 - Hauhe, Mark S. ; et al.	2005-07-14

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