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Patent applications and USPTO patent grants for Roldan; Judith M..The latest application filed is for "direct chip attachment (dca) with electrically conductive adhesives".
Patent | Date |
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Direct chip attachment (DCA) with electrically conductive adhesives Grant 5,747,101 - Booth , et al. May 5, 1 | 1998-05-05 |
Direct chip attachment (DCA) with electrically conductive adhesives Grant 5,543,585 - Booth , et al. August 6, 1 | 1996-08-06 |
Electroless metal adhesion to organic dielectric material with phase separated morphology Grant 5,310,580 - O'Sullivan , et al. May 10, 1 | 1994-05-10 |
Palladium enhanced soldering and bonding of semiconductor device contacts Grant 5,225,711 - Chang , et al. July 6, 1 | 1993-07-06 |
Palladium enhanced fluxless soldering and bonding of semiconductor device contacts Grant 5,048,744 - Chang , et al. September 17, 1 | 1991-09-17 |
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