Rokugawa; Takahiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Rokugawa; Takahiro.The latest application filed is for "substrate fixing device, electrostatic chuck and electrostatic chuck manufacturing method".
- Rokugawa; Takahiro - Nagano-shi JP
- Rokugawa; Takahiro - Nagano JP
| Patent | Date |
|---|---|
| Substrate Fixing Device, Electrostatic Chuck And Electrostatic Chuck Manufacturing Method App 20220157636 - Takemoto; Keiichi ; et al. | 2022-05-19 |
| Wiring board and electronic component device Grant 9,711,476 - Shimodaira , et al. July 18, 2 | 2017-07-18 |
| Wiring Board And Electronic Component Device App 20160365327 - Shimodaira; Tomoyuki ; et al. | 2016-12-15 |
| Wiring substrate Grant 9,431,333 - Rokugawa August 30, 2 | 2016-08-30 |
| Wiring substrate and method of manufacturing wiring substrate Grant 9,334,576 - Miyazawa , et al. May 10, 2 | 2016-05-10 |
| Wiring Substrate App 20160005685 - ROKUGAWA; Takahiro | 2016-01-07 |
| Wiring board and method of manufacturing the same Grant 9,232,641 - Rokugawa , et al. January 5, 2 | 2016-01-05 |
| Wiring Substrate And Method Of Manufacturing Wiring Substrate App 20150245478 - MIYAZAWA; Satoshi ; et al. | 2015-08-27 |
| Wiring Board And Method Of Manufacturing The Same App 20130313010 - Rokugawa; Takahiro ; et al. | 2013-11-28 |
| Substrate transfer apparatus Grant 7,251,021 - Suyama , et al. July 31, 2 | 2007-07-31 |
| Substrate Transfer Apparatus App 20070070325 - Suyama; Toshiaki ; et al. | 2007-03-29 |
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