ROHRMOSER; Bernd
Patent Applications and Registrations
Patent applications and USPTO patent grants for ROHRMOSER; Bernd.The latest application filed is for "leadframe and method for packaging semiconductor die".
- ROHRMOSER; Bernd - Boenningstedt DE
| Patent | Date |
|---|---|
| Leadframe And Method For Packaging Semiconductor Die App 20120286399 - BOETTCHER; Tim ; et al. | 2012-11-15 |
| Quad flat non-leaded package comprising a semiconductor device Grant 7,119,421 - Rohrmoser , et al. October 10, 2 | 2006-10-10 |
| Quad flat non-leaded package comprising a semiconductor device App 20050173793 - Rohrmoser, Bernd ; et al. | 2005-08-11 |
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