Rohm and Haas Electronics Materials CMP Holdings, Inc.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Rohm and Haas Electronics Materials CMP Holdings, Inc..The latest application filed is for "cmp polishing pad with lobed protruding structures".
- Rohm and Haas Electronics Materials CMP Holdings, Inc. - Newark DE US
| Patent | Date |
|---|---|
| Cmp Polishing Pad With Lobed Protruding Structures App 20200384606 - McCormick; John R. | 2020-12-10 |
| Chemical mechanical polishing method for tungsten Grant 10,640,682 - Tsai , et al. | 2020-05-05 |
| Chemical mechanical polishing method for cobalt Grant 10,377,921 - Theivanayagam , et al. A | 2019-08-13 |
| Method of making polishing layer for chemical mechanical polishing pad Grant 10,105,825 - Veneziale , et al. October 23, 2 | 2018-10-23 |
| Soft and conditionable chemical mechanical polishing pad with window Grant 9,064,806 - Qian , et al. June 23, 2 | 2015-06-23 |
| Creep-resistant polishing pad window Grant 8,697,217 - Loyack , et al. April 15, 2 | 2014-04-15 |
| Method for forming a porous reaction injection molded chemical mechanical polishing pad Grant 7,399,437 - James , et al. July 15, 2 | 2008-07-15 |
| CMP pad having overlaid constant area spiral grooves Grant 7,300,340 - Elmufdi , et al. November 27, 2 | 2007-11-27 |
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