Roh; YoungDal

Patent Applications and Registrations

Patent applications and USPTO patent grants for Roh; YoungDal.The latest application filed is for "integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof".

Company Profile

0.11.7

Roh; YoungDal - Icheon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof Grant 10,134,664 - Kang , et al. November 20, 2	2018-11-20
Integrated Circuit Packaging System With Embedded Pad On Layered Substrate And Method Of Manufacture Thereof App 20170162495 - Kang; MinKyung ; et al.	2017-06-08
Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof Grant 9,607,938 - Kang , et al. March 28, 2	2017-03-28
Method of manufacture of support system with fine pitch Grant 9,210,816 - Roh , et al. December 8, 2	2015-12-08
Integrated circuit packaging system with embedded component and method of manufacture thereof Grant 9,171,795 - Jeon , et al. October 27, 2	2015-10-27
Integrated circuit packaging system with coreless substrate and method of manufacture thereof Grant 9,171,739 - Roh , et al. October 27, 2	2015-10-27
Integrated Circuit Packaging System With Embedded Component And Method Of Manufacture Thereof App 20150171002 - Jeon; Dong Ju ; et al.	2015-06-18
Integrated circuit packaging system with coreless substrate and method of manufacture thereof Grant 8,975,665 - Jung , et al. March 10, 2	2015-03-10
Integrated Circuit Packaging System With Embedded Pad On Layered Substrate And Method Of Manufacture Thereof App 20150001705 - Kang; MinKyung ; et al.	2015-01-01
Integrated Circuit Packaging System With Coreless Substrate And Method Of Manufacture Thereof App 20140097475 - Jung; JinHee ; et al.	2014-04-10

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