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Patent applications and USPTO patent grants for Roh; Yong Rae.The latest application filed is for "jig, manufacturing method thereof, and flip chip bonding method for chips of ultrasound probe using jig".
Patent | Date |
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Jig, manufacturing method thereof, and flip chip bonding method for chips of ultrasound probe using jig Grant 9,136,139 - Kim , et al. September 15, 2 | 2015-09-15 |
Jig, Manufacturing Method Thereof, And Flip Chip Bonding Method For Chips Of Ultrasound Probe Using Jig App 20150140824 - KIM; Young Il ;   et al. | 2015-05-21 |
Jig, manufacturing method thereof, and flip chip bonding method for chips of ultrasound probe using jig Grant 8,975,096 - Kim , et al. March 10, 2 | 2015-03-10 |
Jig, Manufacturing Method Thereof, And Flip Chip Bonding Method For Chips Of Ultrasound Probe Using Jig App 20130341303 - KIM; Young Il ;   et al. | 2013-12-26 |
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