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name:-0.022717952728271
name:-0.018756151199341
name:-0.0030558109283447
ROGREN; Philip E. Patent Filings

ROGREN; Philip E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for ROGREN; Philip E..The latest application filed is for "hybrid solid-state cell with a sealed anode structure".

Company Profile
1.10.21
  • ROGREN; Philip E. - Santa Clara CA
  • Rogren; Philip E. - Half Moon Bay CA
  • ROGREN; Philip E - San Jose CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Hybrid Solid-state Cell With A Sealed Anode Structure
App 20200303779 - ROGREN; Philip E.
2020-09-24
Three-dimensional, Additive Manufacturing System, And A Method Of Manufacturing A Three-dimensional Object
App 20200298477 - ROGREN; Philip E.
2020-09-24
Hybrid Ceramic Electrochemical Cell Structure
App 20200220209 - Rogren; Philip E.
2020-07-09
Electrophotographic Multi-material 3d Printer
App 20200171752 - ROGREN; Philip E.
2020-06-04
Three-dimensional, Additive Manufacturing System, And A Method Of Manufacturing A Three-dimensional Object
App 20200108553 - ROGREN; Philip E.
2020-04-09
Hybrid Solid-state Cell With A Sealed Anode Structure
App 20200106135 - ROGREN; Philip E.
2020-04-02
Ceramic lithium retention device
Grant 10,581,111 - Rogren
2020-03-03
Hybrid solid-state cell with a sealed anode structure
Grant 10,535,900 - Rogren Ja
2020-01-14
Multi-material Three-dimensional Printer
App 20190375159 - ROGREN; Philip E. ;   et al.
2019-12-12
Hybrid Solid-state Cell With A Sealed Anode Structure
App 20190237808 - ROGREN; Philip E.
2019-08-01
Ceramic Lithium Retention Device
App 20180219251 - ROGREN; Philip E.
2018-08-02
Lead Carrier With Print Formed Package Components And Conductive Path Redistribution Structures
App 20180047589 - ROGREN; Philip E
2018-02-15
Lead Carrier Structure And Packages Formed Therefrom Without Die Attach Pads
App 20180047588 - ROGREN; Philip E
2018-02-15
Lead Carrier Structure And Packages Formed Therefrom Without Die Attach Pads
App 20180034038 - ROGREN; Philip E
2018-02-01
Multi-material three dimensional printer
Grant 9,604,411 - Rogren March 28, 2
2017-03-28
Lead carrier with print-formed terminal pads
Grant 9,184,114 - Rogren November 10, 2
2015-11-10
Multi-material Three Dimensional Printer
App 20150314530 - Rogren; Philip E.
2015-11-05
Lead Carrier With Thermally Fused Package Components
App 20150194322 - Rogren; Philip E.
2015-07-09
Lead carrier with print-formed package components
Grant 8,865,524 - Rogren October 21, 2
2014-10-21
Lead carrier with multi-material print formed package components
Grant 8,749,035 - Rogren June 10, 2
2014-06-10
Lead Carrier With Print-formed Terminal Pads
App 20140070391 - Rogren; Philip E.
2014-03-13
Lead Carrier With Print-formed Package Components
App 20140004663 - Rogren; Philip E.
2014-01-02
Lead carrier with print-formed package components
Grant 8,525,305 - Rogren September 3, 2
2013-09-03
Lead Carrier With Multi-material Print Formed Package Components
App 20130037927 - Rogren; Philip E.
2013-02-14
Lead Carrier With Thermally Fused Package Components
App 20130001761 - Rogren; Philip E.
2013-01-03
Device and method for forming and attaching an array of conductive balls
Grant 5,620,129 - Rogren April 15, 1
1997-04-15

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