| Patent | Date |
|---|
Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device
Grant 11,424,201 - Rogalli , et al. August 23, 2 | 2022-08-23 |
Chip Package And Method Of Forming A Chip Package
App 20210375792 - SAX; Harry Walter ; et al. | 2021-12-02 |
Adhesion Enhancing Structures for a Package
App 20200043876 - Napetschnig; Evelyn ; et al. | 2020-02-06 |
Semiconductor device having a copper element and method of forming a semiconductor device having a copper element
Grant 10,446,469 - Detzel , et al. Oc | 2019-10-15 |
Method of Forming an Aluminum Oxide Layer, Metal Surface with Aluminum Oxide Layer, and Electronic Device
App 20180366427 - Rogalli; Michael ; et al. | 2018-12-20 |
Semiconductor devices and processing methods
Grant 10,103,123 - Rogalli , et al. October 16, 2 | 2018-10-16 |
Semiconductor Devices And Processing Methods
App 20170236801 - Rogalli; Michael ; et al. | 2017-08-17 |
Semiconductor Device Having a Copper Element and Method of Forming a Semiconductor Device Having a Copper Element
App 20160329263 - Detzel; Thomas ; et al. | 2016-11-10 |
Integrated circuit and method of forming an integrated circuit
Grant 9,418,937 - Detzel , et al. August 16, 2 | 2016-08-16 |
Method for providing a self-aligned pad protection in a semiconductor device
Grant 9,385,031 - Rogalli , et al. July 5, 2 | 2016-07-05 |
Method For Providing A Self-aligned Pad Protection In A Semiconductor Device
App 20150357234 - Rogalli; Michael ; et al. | 2015-12-10 |
Method for providing a self-aligned pad protection in a semiconductor device
Grant 9,165,821 - Rogalli , et al. October 20, 2 | 2015-10-20 |
Methods For Processing A Semiconductor Device
App 20150179507 - Rogalli; Michael ; et al. | 2015-06-25 |
Semiconductor Devices And Processing Methods
App 20140110838 - Rogalli; Michael ; et al. | 2014-04-24 |
Integrated Circuit and Method of Forming an Integrated Circuit
App 20130147047 - Detzel; Thomas ; et al. | 2013-06-13 |
Sensor device and a method for its manufacturing
App 20080006098 - Rogalli; Michael | 2008-01-10 |
Photosensitive lacquer for providing a coating on a semiconductor substrate or a mask
Grant 7,169,716 - Rogalli , et al. January 30, 2 | 2007-01-30 |
Process for the back-surface grinding of wafers
Grant 6,958,256 - Rogalli , et al. October 25, 2 | 2005-10-25 |
Photosensitive lacquer for providing a coating on a semiconductor substrate or a mask
App 20050130444 - Rogalli, Michael ; et al. | 2005-06-16 |
Method for the production of a semiconductor device
App 20050090114 - Rogalli, Michael ; et al. | 2005-04-28 |
Method for fabricating thin metal layers from the liquid phase
Grant 6,790,737 - Schneegans , et al. September 14, 2 | 2004-09-14 |
Process for the back-surface grinding of wafers
App 20040147120 - Rogalli, Michael ; et al. | 2004-07-29 |
Method for fabricating thin metal layers from the liquid phase
App 20030181037 - Schneegans, Manfred ; et al. | 2003-09-25 |
Dielectric filling of electrical wiring planes
App 20010004539 - Kirchhoff, Markus ; et al. | 2001-06-21 |
Chip card
Grant 5,917,705 - Kirschbauer , et al. June 29, 1 | 1999-06-29 |
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