| Patent | Date |
|---|
Component and Method of Manufacturing a Component Using an Ultrathin Carrier
App 20220246475 - Mayer; Karl ; et al. | 2022-08-04 |
Component and method of manufacturing a component using an ultrathin carrier
Grant 11,367,654 - Mayer , et al. June 21, 2 | 2022-06-21 |
Silicon carbide devices and methods for manufacturing the same
Grant 11,282,805 - Roesner , et al. March 22, 2 | 2022-03-22 |
Methods of forming a silicon-insulator layer and semiconductor device having the same
Grant 11,195,713 - Hirschler , et al. December 7, 2 | 2021-12-07 |
Method of processing a silicon carbide containing crystalline substrate, silicon carbide chip, and processing chamber
Grant 11,077,525 - Roesner , et al. August 3, 2 | 2021-08-03 |
Semiconductor devices including a metal silicide layer and methods for manufacturing thereof
Grant 11,063,014 - Roesner , et al. July 13, 2 | 2021-07-13 |
Integrated circuit substrate and method for manufacturing the same
Grant 10,672,716 - Roesner , et al. | 2020-06-02 |
Magnetic phase change material for heat dissipation
Grant 10,643,917 - Roesner , et al. | 2020-05-05 |
Segmented edge protection shield
Grant 10,622,218 - Engelhardt , et al. | 2020-04-14 |
Methods of Forming a Silicon-Insulator Layer and Semiconductor Device Having the Same
App 20190385842 - Hirschler; Joachim ; et al. | 2019-12-19 |
Semiconductor Devices Including a Metal Silicide Layer and Methods for Manufacturing Thereof
App 20190355691 - Roesner; Michael ; et al. | 2019-11-21 |
Method of Processing a Silicon Carbide Containing Crystalline Substrate, Silicon Carbide Chip, and Processing Chamber
App 20190308274 - Roesner; Michael ; et al. | 2019-10-10 |
Silicon Carbide Devices and Methods for Manufacturing the Same
App 20190295981 - Roesner; Michael ; et al. | 2019-09-26 |
Method of processing a porous conductive structure in connection to an electronic component on a substrate
Grant 10,373,868 - Mischitz , et al. | 2019-08-06 |
Component and Method of Manufacturing a Component Using an Ultrathin Carrier
App 20190148233 - Mayer; Karl ; et al. | 2019-05-16 |
Magnetic Phase Change Material for Heat Dissipation
App 20190096780 - Roesner; Michael ; et al. | 2019-03-28 |
Component and method of manufacturing a component using an ultrathin carrier
Grant 10,186,458 - Mayer , et al. Ja | 2019-01-22 |
Methods for processing a semiconductor workpiece
Grant 10,157,765 - Stranzl , et al. Dec | 2018-12-18 |
Integrated Circuit Substrate and Method for Manufacturing the Same
App 20180315713 - Roesner; Michael ; et al. | 2018-11-01 |
Plasma dicing of silicon carbide
Grant 10,032,670 - Roesner , et al. July 24, 2 | 2018-07-24 |
Integrated circuit substrate and method for manufacturing the same
Grant 10,020,264 - Roesner , et al. July 10, 2 | 2018-07-10 |
Method for simultaneous structuring and chip singulation
Grant 10,005,659 - Grille , et al. June 26, 2 | 2018-06-26 |
Source down semiconductor devices and methods of formation thereof
Grant 9,911,686 - Schneegans , et al. March 6, 2 | 2018-03-06 |
Segmented Edge Protection Shield
App 20180005838 - Engelhardt; Manfred ; et al. | 2018-01-04 |
Plasma Dicing Of Silicon Carbide
App 20170358494 - Roesner; Michael ; et al. | 2017-12-14 |
Segmented edge protection shield
Grant 9,793,129 - Engelhardt , et al. October 17, 2 | 2017-10-17 |
Method For Processing A Substrate And An Electronic Device
App 20170207123 - MISCHITZ; Martin ; et al. | 2017-07-20 |
Method of dicing a wafer
Grant 9,704,748 - Ortner , et al. July 11, 2 | 2017-07-11 |
Method for Simultaneous Structuring and Chip Singulation
App 20170158493 - Grille; Thomas ; et al. | 2017-06-08 |
Method for processing a semiconductor substrate and a method for processing a semiconductor wafer
Grant 9,673,096 - Hirschler , et al. June 6, 2 | 2017-06-06 |
Carrier system for processing semiconductor substrates, and methods thereof
Grant 9,640,419 - Schneegans , et al. May 2, 2 | 2017-05-02 |
Method for simultaneous structuring and chip singulation
Grant 9,610,543 - Grille , et al. April 4, 2 | 2017-04-04 |
Methods For Processing A Semiconductor Workpiece
App 20170076970 - Stranzl; Gudrun ; et al. | 2017-03-16 |
Method of Dicing a Wafer
App 20160379884 - Ortner; Joerg ; et al. | 2016-12-29 |
Segmented Edge Protection Shield
App 20160343574 - Engelhardt; Manfred ; et al. | 2016-11-24 |
Semiconductor chip with structured sidewalls
Grant 9,496,193 - Roesner , et al. November 15, 2 | 2016-11-15 |
Integrated Circuit Substrate and Method for Manufacturing the Same
App 20160322306 - Roesner; Michael ; et al. | 2016-11-03 |
Kerf preparation for backside metallization
Grant 9,455,192 - Roesner , et al. September 27, 2 | 2016-09-27 |
Singulation of semiconductor dies with contact metallization by electrical discharge machining
Grant 9,449,876 - Roesner , et al. September 20, 2 | 2016-09-20 |
Source Down Semiconductor Devices and Methods of Formation Thereof
App 20160260658 - Schneegans; Manfred ; et al. | 2016-09-08 |
Embrittlement device, pick-up system and method of picking up chips
App 20160204017 - Roesner; Michael ; et al. | 2016-07-14 |
Source down semiconductor devices and methods of formation thereof
Grant 9,368,436 - Schneegans , et al. June 14, 2 | 2016-06-14 |
Carrier System For Processing Semiconductor Substrates, and Methods Thereof
App 20160035560 - Schneegans; Manfred ; et al. | 2016-02-04 |
Kerf Preparation for Backside Metallization
App 20150279740 - Roesner; Michael ; et al. | 2015-10-01 |
Method for Simultaneous Structuring and Chip Singulation
App 20150217997 - Grille; Thomas ; et al. | 2015-08-06 |
Singulation of Semiconductor Dies with Contact Metallization by Electrical Discharge Machining
App 20150206802 - Roesner; Michael ; et al. | 2015-07-23 |
Methods for processing a semiconductor wafer
Grant 9,059,273 - Fischer , et al. June 16, 2 | 2015-06-16 |
Methods For Processing A Semiconductor Workpiece
App 20150147850 - Stranzl; Gudrun ; et al. | 2015-05-28 |
Methods For Processing A Semiconductor Wafer
App 20150064877 - Fischer; Petra ; et al. | 2015-03-05 |
Methods of forming semiconductor devices
Grant 8,815,706 - Hirschler , et al. August 26, 2 | 2014-08-26 |
Component and Method of Manufacturing a Component Using an Ultrathin Carrier
App 20140008805 - Mayer; Karl ; et al. | 2014-01-09 |
Methods of Forming Semiconductor Devices
App 20130189830 - Hirschler; Joachim ; et al. | 2013-07-25 |
Device for the storage and use of at least one photomask for lithographic projection and method for using the device in an exposure installation
App 20070187272 - Bonness; Anja ; et al. | 2007-08-16 |
Apparatus for and method of wafer grinding
Grant 6,752,694 - Schneegans , et al. June 22, 2 | 2004-06-22 |
Apparatus For And Method Of Wafer Grinding
App 20040092209 - Schneegans, Manfred ; et al. | 2004-05-13 |
Apparatus and method for measuring the degradation of a tool
Grant 6,633,379 - Roesner , et al. October 14, 2 | 2003-10-14 |
Apparatus and method for measuring the degradation of a tool
App 20020186370 - Roesner, Michael ; et al. | 2002-12-12 |
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