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Patent applications and USPTO patent grants for Roemer; Andreas.The latest application filed is for "method of planarizing substrates".
Patent | Date |
---|---|
Method of determining the endpoint of a planarization process Grant 6,932,674 - Lahnor , et al. August 23, 2 | 2005-08-23 |
Process and device for the abrasive machining of surfaces, in particular semiconductor wafers Grant 6,858,449 - Hollatz , et al. February 22, 2 | 2005-02-22 |
Method of planarizing substrates Grant 6,827,635 - Lahnor , et al. December 7, 2 | 2004-12-07 |
Method Of Planarizing Substrates App 20040185756 - Lahnor, Peter ;   et al. | 2004-09-23 |
Method Of Determining The Endpoint Of A Planarization Process App 20040176015 - Lahnor, Peter ;   et al. | 2004-09-09 |
Process and device for the abrasive machining of surfaces, in particular semiconductor wafers App 20020197872 - Hollatz, Mark ;   et al. | 2002-12-26 |
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