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Patent applications and USPTO patent grants for Rockford; Lee.The latest application filed is for "multiple layer deposition for improving adhesion".
Patent | Date |
---|---|
Multiple layer deposition for improving adhesion Grant 7,579,070 - Rockford August 25, 2 | 2009-08-25 |
Multiple layer deposition for improving adhesion App 20070048514 - Rockford; Lee | 2007-03-01 |
Low-k dielectric film with good mechanical strength that varies in local porosity depending on location on substrate--therein Grant 7,145,245 - Kloster , et al. December 5, 2 | 2006-12-05 |
Low-K dielectric film with good mechanical strength that varies in local porosity depending on location on substrate - therein App 20060009031 - Kloster; Grant ;   et al. | 2006-01-12 |
Low-k dielectric film with good mechanical strength Grant 6,964,919 - Kloster , et al. November 15, 2 | 2005-11-15 |
Low-k dielectric film with good mechanical strength App 20040026783 - Kloster, Grant ;   et al. | 2004-02-12 |
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