ROBLES; Roel Adeva

Patent Applications and Registrations

Patent applications and USPTO patent grants for ROBLES; Roel Adeva.The latest application filed is for "semiconductor packages with integrated shielding".

Company Profile

4.7.8

ROBLES; Roel Adeva - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Packages With Integrated Shielding App 20220028798 - SIRINORAKUL; Saravuth ; et al.	2022-01-27
Stacked dies electrically connected to a package substrate by lead terminals Grant 11,227,818 - Lam , et al. January 18, 2	2022-01-18
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20210035891 - LAM; Wing Keung ; et al.	2021-02-04
Semiconductor packages with electromagnetic interference shielding Grant 10,714,431 - Dimaano, Jr. , et al.	2020-07-14
Semiconductor package with a heat spreader and method of manufacturing thereof Grant 10,658,277 - Dimaano, Jr. , et al.	2020-05-19
Multi-layer leadless semiconductor package and method of manufacturing the same Grant 10,573,590 - Dimaano, Jr. , et al. Feb	2020-02-25
Semiconductor packages and methods of packaging semiconductor devices Grant 10,354,934 - Suthiwongsunthorn , et al. July 16, 2	2019-07-16
Semiconductor Packages With Electromagnetic Interference Shielding App 20190051614 - DIMAANO JR.; Antonio Bambalan ; et al.	2019-02-14
Thermally Enhanced Leadless Semiconductor Package And Method Of Manufacturing Thereof App 20190051585 - DIMAANO JR.; Antonio Bambalan ; et al.	2019-02-14
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20180240726 - SUTHIWONGSUNTHORN; Nathapong ; et al.	2018-08-23
Semiconductor packages and methods of packaging semiconductor devices Grant 9,978,658 - Suthiwongsunthorn , et al. May 22, 2	2018-05-22
Multi-layer Leadless Semiconductor Package And Method Of Manufacturing The Same App 20180114749 - Dimaano, JR.; Antonio Bambalan ; et al.	2018-04-26
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20170077007 - SUTHIWONGSUNTHORN; Nathapong ; et al.	2017-03-16
Semiconductor packages and methods of packaging semiconductor devices Grant 9,508,623 - Suthiwongsunthorn , et al. November 29, 2	2016-11-29
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20150357256 - SUTHIWONGSUNTHORN; Nathapong ; et al.	2015-12-10

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