| Patent | Date |
|---|
Semiconductor device power metallization layer with stress-relieving heat sink structure
Grant 11,276,624 - Nelhiebel , et al. March 15, 2 | 2022-03-15 |
Semiconductor device and a method of forming the semiconductor device
Grant 11,171,049 - Robl , et al. November 9, 2 | 2021-11-09 |
Semiconductor Device Power Metallization Layer with Stress-Relieving Heat Sink Structure
App 20210183732 - Nelhiebel; Michael ; et al. | 2021-06-17 |
Electronic Device, Electronic Module And Methods For Fabricating The Same
App 20200343094 - Frank; Paul ; et al. | 2020-10-29 |
Electronic device, electronic module and methods for fabricating the same
Grant 10,741,402 - Frank , et al. A | 2020-08-11 |
Electrolyte, method of forming a copper layer and method of forming a chip
Grant 10,648,096 - Robl , et al. | 2020-05-12 |
Semiconductor device having a copper element and method of forming a semiconductor device having a copper element
Grant 10,446,469 - Detzel , et al. Oc | 2019-10-15 |
Semiconductor Device And A Method Of Forming The Semiconductor Device
App 20190267283 - Robl; Werner ; et al. | 2019-08-29 |
Semiconductor Devices Comprising Metallizations Composed Of Porous Copper And Associated Production Methods
App 20190221533 - THEUSS; Horst ; et al. | 2019-07-18 |
Self-organizing barrier layer disposed between a metallization layer and a semiconductor region
Grant 10,332,793 - Robl , et al. | 2019-06-25 |
Electronic Device, Electronic Module And Methods For Fabricating The Same
App 20180082848 - Frank; Paul ; et al. | 2018-03-22 |
Self-organizing Barrier Layer Disposed Between A Metallization Layer And A Semiconductor Region
App 20170154813 - Robl; Werner ; et al. | 2017-06-01 |
Semiconductor Structure And Method For Making Same
App 20160343662 - Fischer; Thomas ; et al. | 2016-11-24 |
Semiconductor Device Having a Copper Element and Method of Forming a Semiconductor Device Having a Copper Element
App 20160329263 - Detzel; Thomas ; et al. | 2016-11-10 |
Semiconductor structure and method for making same
Grant 9,425,146 - Fischer , et al. August 23, 2 | 2016-08-23 |
Integrated circuit and method of forming an integrated circuit
Grant 9,418,937 - Detzel , et al. August 16, 2 | 2016-08-16 |
Electrolyte, Method Of Forming A Copper Layer And Method Of Forming A Chip
App 20160168739 - ROBL; Werner ; et al. | 2016-06-16 |
Porous Metal Coating
App 20140242374 - Strasser; Johann ; et al. | 2014-08-28 |
Semiconductor structure and method for making same
Grant 8,786,085 - Barth , et al. July 22, 2 | 2014-07-22 |
Semiconductor structure and method for making same
Grant 8,759,207 - Barth , et al. June 24, 2 | 2014-06-24 |
Semiconductor component with coreless transformer
Grant 8,665,054 - Stecher , et al. March 4, 2 | 2014-03-04 |
Semiconductor Structure And Method For Making Same
App 20130309864 - BARTH; Hans-Joachim ; et al. | 2013-11-21 |
Semiconductor Component with Coreless Transformer
App 20130278372 - Stecher; Matthias ; et al. | 2013-10-24 |
Integrated Circuit and Method of Forming an Integrated Circuit
App 20130147047 - Detzel; Thomas ; et al. | 2013-06-13 |
Semiconductor Structure And Method For Making Same
App 20130062770 - BARTH; Hans-Joachim ; et al. | 2013-03-14 |
Method for processing a semiconductor wafer or die, and particle deposition device
Grant 8,338,317 - Engelhardt , et al. December 25, 2 | 2012-12-25 |
Device fabricated using an electroplating process
Grant 8,334,202 - Pohl , et al. December 18, 2 | 2012-12-18 |
Semiconductor structure and method for making same
Grant 8,330,274 - Barth , et al. December 11, 2 | 2012-12-11 |
Method For Processing A Semiconductor Wafer Or Die, And Particle Deposition Device
App 20120256323 - Engelhardt; Manfred ; et al. | 2012-10-11 |
Semiconductor Structure And Method For Making Same
App 20120080791 - BARTH; Hans-Joachim ; et al. | 2012-04-05 |
Semiconductor structure and method for making same
Grant 8,148,257 - Barth , et al. April 3, 2 | 2012-04-03 |
Semiconductor Structure And Method For Making Same
App 20120074574 - BARTH; Hans-Joachim ; et al. | 2012-03-29 |
Semiconductor Structure And Method For Making Same
App 20120074572 - FISCHER; Thomas ; et al. | 2012-03-29 |
Semiconductor device including conductive element
Grant 8,072,071 - Steiner , et al. December 6, 2 | 2011-12-06 |
Method for Fabricating a Semiconductor Chip Package and Semiconductor Chip Package
App 20110291256 - Steiner; Rainer ; et al. | 2011-12-01 |
Spin device
Grant 7,974,120 - Poeppel , et al. July 5, 2 | 2011-07-05 |
Device Fabricated Using An Electroplating Process
App 20110101532 - Pohl; Jens ; et al. | 2011-05-05 |
Method of making an integrated circuit including electrodeposition of metallic chromium
Grant 7,909,978 - Lodermeyer , et al. March 22, 2 | 2011-03-22 |
Semiconductor Device Including Conductive Element
App 20100207272 - Steiner; Rainer ; et al. | 2010-08-19 |
Spin Device
App 20100188905 - Poeppel; Gerhard ; et al. | 2010-07-29 |
Method Of Making An Integrated Circuit Including Electrodeposition Of Metallic Chromium
App 20080257743 - Lodermeyer; Johannes ; et al. | 2008-10-23 |
Method Of Making An Integrated Circuit Including Electrodeposition Of Aluminium
App 20080257744 - Lodermeyer; Johannes ; et al. | 2008-10-23 |
Nitride and polysilicon interface with titanium layer
App 20060001162 - Schutz; Ronald J. ; et al. | 2006-01-05 |
Low Cu percentages for reducing shorts in AlCu lines
Grant 6,960,306 - Iggulden , et al. November 1, 2 | 2005-11-01 |
Integration scheme for metal gap fill, with fixed abrasive CMP
Grant 6,943,114 - Wrschka , et al. September 13, 2 | 2005-09-13 |
Integration scheme for metal gap fill, with fixed abrasive CMP
App 20040248399 - Wrschka, Peter ; et al. | 2004-12-09 |
Three layer aluminum deposition process for high aspect ratio CL contacts
Grant 6,794,282 - Goebel , et al. September 21, 2 | 2004-09-21 |
Method and apparatus for improving the electrical resistance of conductive paths
App 20040155268 - Robl, Werner ; et al. | 2004-08-12 |
Three layer aluminum deposition process for high aspect ratio CL contacts
App 20040102001 - Goebel, Thomas ; et al. | 2004-05-27 |
Liner with poor step coverage to improve contact resistance in W contacts
Grant 6,734,097 - Iggulden , et al. May 11, 2 | 2004-05-11 |
Method of eliminating back-end rerouting in ball grid array packaging
Grant 6,720,212 - Robl , et al. April 13, 2 | 2004-04-13 |
Method of eliminating back-end rerouting in ball grid array packaging
App 20030183913 - Robl, Werner ; et al. | 2003-10-02 |
Integration scheme for metal gap fill with HDP and fixed abrasive CMP
App 20030186551 - Wrschka, Peter ; et al. | 2003-10-02 |
Liner with poor step coverage to improve contact resistance in W contacts
App 20030068894 - Iggulden, Roy C. ; et al. | 2003-04-10 |
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