Robinson; Marc E.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Robinson; Marc E..The latest application filed is for "support mounted electrically interconnected die assembly".
- Robinson; Marc E. - San Jose CA
| Patent | Date |
|---|---|
| Semiconductor die mount by conformal die coating Grant 9,824,999 - Crane , et al. November 21, 2 | 2017-11-21 |
| Support Mounted Electrically Interconnected Die Assembly App 20160218088 - McElrea; Simon J. S. ; et al. | 2016-07-28 |
| Semiconductor Die Mount By Conformal Die Coating App 20160104689 - Crane; Scott Jay ; et al. | 2016-04-14 |
| Support mounted electrically interconnected die assembly Grant 9,305,862 - McElrea , et al. April 5, 2 | 2016-04-05 |
| Semiconductor die mount by conformal die coating Grant 9,252,116 - Crane , et al. February 2, 2 | 2016-02-02 |
| Semiconductor Die Mount By Conformal Die Coating App 20140213020 - Crane; Scott Jay ; et al. | 2014-07-31 |
| Assembly having stacked die mounted on substrate Grant 8,729,690 - Vindasius , et al. May 20, 2 | 2014-05-20 |
| Electrically interconnected stacked die assemblies Grant 8,723,332 - McElrea , et al. May 13, 2 | 2014-05-13 |
| Semiconductor die mount by conformal die coating Grant 8,704,379 - Crane , et al. April 22, 2 | 2014-04-22 |
| Electrically interconnected stacked die assemblies Grant 8,629,543 - McElrea , et al. January 14, 2 | 2014-01-14 |
| Assembly Having Stacked Die Mounted On Substrate App 20130207249 - Vindasius; Al ; et al. | 2013-08-15 |
| Support mounted electrically interconnected die assembly App 20130099392 - McElrea; Simon J. S. ; et al. | 2013-04-25 |
| Assembly having stacked die mounted on substrate Grant 8,357,999 - Robinson , et al. January 22, 2 | 2013-01-22 |
| Support mounted electrically interconnected die assembly Grant 8,178,978 - McElrea , et al. May 15, 2 | 2012-05-15 |
| Electrically Interconnected Stacked Die Assemblies App 20110037159 - McElrea; Simon J. S. ; et al. | 2011-02-17 |
| Sensor App 20100117224 - McElrea; Simon J. S. ; et al. | 2010-05-13 |
| Image Sensor App 20100052087 - McElrea; Simon J. S. ; et al. | 2010-03-04 |
| Support Mounted Electrically Interconnected Die Assembly App 20090230528 - McElrea; Simon J. S. ; et al. | 2009-09-17 |
| Die assembly having electrical interconnect Grant 7,535,109 - Robinson , et al. May 19, 2 | 2009-05-19 |
| Chip Scale Stacked Die Package App 20090102038 - MCELREA; SIMON J.S. ; et al. | 2009-04-23 |
| Semiconductor Die Mount By Conformal Die Coating App 20090065916 - Crane; Scott Jay ; et al. | 2009-03-12 |
| Electrically Interconnected Stacked Die Assemblies App 20080303131 - McElrea; Simon J.S. ; et al. | 2008-12-11 |
| Conductive epoxy flip-chip on chip Grant 6,271,598 - Vindasius , et al. August 7, 2 | 2001-08-07 |
| Method for forming conductive epoxy flip-chip on chip Grant 6,098,278 - Vindasius , et al. August 8, 2 | 2000-08-08 |
| SEC | 0001538886 | ROBINSON MARC E |
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