Robinson; Karl M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Robinson; Karl M..The latest application filed is for "sacrificial self-aligned interconnect structures".

Company Profile

0.61.33

Robinson; Karl M. - Boise ID
Robinson; Karl M. - Beaverton OR
ROBINSON, KARL M - BOISE ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sacrificial self-aligned interconnect structures Grant 7,825,450 - Walker , et al. November 2, 2	2010-11-02
Sacrificial Self-aligned Interconnect Structures App 20080315330 - Walker; Michael A. ; et al.	2008-12-25
Sacrificial self-aligned interconnect structure Grant 7,427,793 - Walker , et al. September 23, 2	2008-09-23
Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies Grant 7,276,446 - Robinson , et al. October 2, 2	2007-10-02
Devices having improved capacitance Grant 7,205,599 - Robinson April 17, 2	2007-04-17
Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes Grant 7,132,035 - Robinson , et al. November 7, 2	2006-11-07
Devices having improved capacitance and methods of their fabrication Grant 7,126,205 - Robinson October 24, 2	2006-10-24
Methods And Apparatus For Devices Having Improved Capacitance App 20060216532 - Robinson; Karl M.	2006-09-28
Methods And Apparatus For Devices Having Improved Capacitance App 20060196024 - Robinson; Karl M.	2006-09-07
Sacrificial self-aligned interconnect structure App 20060113576 - Walker; Michael A. ; et al.	2006-06-01
Method of making sacrificial self-aligned interconnection structure Grant 6,995,072 - Walker , et al. February 7, 2	2006-02-07
Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies App 20050107010 - Robinson, Karl M. ; et al.	2005-05-19
Method and apparatus for increasing chemical-mechanical-polishing selectivity Grant 6,893,325 - Robinson May 17, 2	2005-05-17
Devices having improved capacitance and methods of their fabrication App 20050037592 - Robinson, Karl M.	2005-02-17
Devices having improved capacitance and methods of their fabrication Grant 6,838,353 - Robinson January 4, 2	2005-01-04
Method of making a self-aligned recessed container cell capacitor Grant 6,818,501 - Walker , et al. November 16, 2	2004-11-16
Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies Grant 6,805,615 - Robinson , et al. October 19, 2	2004-10-19
System for performing thermal reflow operations under high gravity conditions Grant 6,747,249 - Robinson , et al. June 8, 2	2004-06-08
Fixed abrasive polishing pad App 20040106367 - Walker, Michael A. ; et al.	2004-06-03
Sacrificial self-aligned interconnect structure and method of making App 20040106299 - Walker, Michael A. ; et al.	2004-06-03
Fixed abrasive polishing pad Grant 6,672,951 - Walker , et al. January 6, 2	2004-01-06
Devices having improved capacitance and methods of their fabrication Grant 6,660,610 - Robinson December 9, 2	2003-12-09
Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes Grant 6,645,865 - Robinson , et al. November 11, 2	2003-11-11
System for performing thermal reflow operations under high gravity conditions App 20030192870 - Robinson, Karl M. ; et al.	2003-10-16
Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes Grant 6,613,675 - Robinson , et al. September 2, 2	2003-09-02
Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies Grant 6,599,836 - Robinson , et al. July 29, 2	2003-07-29
Fixed abrasive polishing pad App 20030114088 - Walker, Michael A. ; et al.	2003-06-19
Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes App 20030054651 - Robinson, Karl M. ; et al.	2003-03-20
Planarization process Grant 6,521,536 - Robinson February 18, 2	2003-02-18
Treatment of exposed silicon and silicon dioxide surfaces Grant 6,521,534 - Robinson , et al. February 18, 2	2003-02-18
Apparatus and methods for chemical mechanical polishing with an incrementally advanceable polishing sheet Grant 6,520,841 - Birang , et al. February 18, 2	2003-02-18
Composition and method of formation and use therefor in chemical-mechanical polishing App 20020185628 - Robinson, Karl M. ; et al.	2002-12-12
Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers Grant 6,458,015 - Robinson , et al. October 1, 2	2002-10-01
Method and apparatus for performing thermal reflow operations under high gravity conditions App 20020108941 - Robinson, Karl M. ; et al.	2002-08-15
Fixed Abrasive Polishing Pad App 20020102921 - Walker , Michael A. ; et al.	2002-08-01
Method and apparatus for increasing chemical-mechanical-polishing selectivity App 20020072302 - Robinson, Karl M.	2002-06-13
Fixed abrasive polishing pad App 20020058464 - Walker, Michael A. ; et al.	2002-05-16
Apparatus and methods for chemical mechanical polishing with an incrementally advanceable polishing sheet App 20020052171 - Birang, Manoocher ; et al.	2002-05-02
Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers App 20020052052 - Robinson, Karl M. ; et al.	2002-05-02
Fixed abrasive polishing pad App 20020049027 - Walker, Michael A. ; et al.	2002-04-25
Devices Having Improved Capacitance And Methods Of Their Fabrication App 20020038879 - ROBINSON, KARL M	2002-04-04
Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates Grant 6,361,417 - Walker , et al. March 26, 2	2002-03-26
Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers App 20020022439 - Robinson, Karl M.	2002-02-21
Method and apparatus for performing thermal reflow operations under high gravity conditions App 20010052514 - Robinson, Karl M. ; et al.	2001-12-20
Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates Grant 6,331,139 - Walker , et al. December 18, 2	2001-12-18
Devices Having Improved Capacitance And Methods Of Their Fabrication App 20010050384 - ROBINSON, KARL M.	2001-12-13
Method of making a self-aligned recessed container cell capacitor App 20010046751 - Walker, Michael A. ; et al.	2001-11-29
Fixed Abrasive Polishing Pad App 20010044271 - WALKER, MICHAEL A. ; et al.	2001-11-22
Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes App 20010019895 - Robinson, Karl M. ; et al.	2001-09-06
Methods of polishing materials, methods of slowing a rate of material removal of a polishing process, and methods of forming trench isolation regions App 20010018314 - Walker, Michael A. ; et al.	2001-08-30
Polishing pad and system Grant 6,277,015 - Robinson , et al. August 21, 2	2001-08-21
Method and apparatus for increasing chemical-mechanical-polishing selectivity App 20010014571 - Robinson, Karl M.	2001-08-16
Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates Grant 6,273,800 - Walker , et al. August 14, 2	2001-08-14
Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes App 20010010972 - Robinson, Karl M. ; et al.	2001-08-02
Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes App 20010009811 - Robinson, Karl M. ; et al.	2001-07-26
Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates App 20010006877 - Walker, Michael A. ; et al.	2001-07-05
Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates App 20010006878 - Walker, Michael A. ; et al.	2001-07-05
Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates App 20010006879 - Walker, Michael A. ; et al.	2001-07-05
Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers Grant 6,238,270 - Robinson May 29, 2	2001-05-29
Method and apparatus for increasing-chemical-polishing selectivity Grant 6,203,407 - Robinson March 20, 2	2001-03-20
Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes Grant 6,191,037 - Robinson , et al. February 20, 2	2001-02-20
Method of preparing integrated circuit devices containing isolated dielectric material Grant 6,174,780 - Robinson January 16, 2	2001-01-16
Method for electrochemical oxidation of silicon Grant 6,143,627 - Robinson November 7, 2	2000-11-07
Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers Grant 6,143,123 - Robinson , et al. November 7, 2	2000-11-07
Polishing pad methods of manufacture and use Grant 6,136,043 - Robinson , et al. October 24, 2	2000-10-24
Slurries for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods and apparatuses for making and using such slurries Grant 6,124,207 - Robinson , et al. September 26, 2	2000-09-26
Formation of planar dielectric layers using liquid interfaces Grant 6,103,638 - Robinson August 15, 2	2000-08-15
Wet cleans for composite surfaces Grant 6,098,639 - Robinson August 8, 2	2000-08-08
Isolation regions and methods of forming isolation regions Grant 6,093,953 - Pan , et al. July 25, 2	2000-07-25
Polishing pad, methods of manufacturing and use Grant 6,090,475 - Robinson , et al. July 18, 2	2000-07-18
Isolation regions and methods of forming isolation regions Grant 6,066,544 - Pan , et al. May 23, 2	2000-05-23
Planarization process with abrasive polishing slurry that is selective to a planarized surface Grant 6,062,952 - Robinson , et al. May 16, 2	2000-05-16
Method and apparatus for endpointing mechanical and chemical-mechanical planarization of microelectronic substrates Grant 6,046,111 - Robinson April 4, 2	2000-04-04
Chemical-mechanical polishing of hydrophobic materials by use of incorporated-particle polishing pads Grant 5,990,012 - Robinson , et al. November 23, 1	1999-11-23
Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers Grant 5,981,396 - Robinson , et al. November 9, 1	1999-11-09
Wet cleans for composite surfaces Grant 5,944,906 - Robinson August 31, 1	1999-08-31
Polishing pad and a method for making a polishing pad with covalently bonded particles Grant 5,938,801 - Robinson August 17, 1	1999-08-17
Fixed abrasive polishing pad Grant 5,919,082 - Walker , et al. July 6, 1	1999-07-06
Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers Grant 5,882,248 - Wright , et al. March 16, 1	1999-03-16
Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers Grant 5,879,226 - Robinson March 9, 1	1999-03-09
Abrasive polishing pad with covalently bonded abrasive particles Grant 5,879,222 - Robinson March 9, 1	1999-03-09
Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers Grant 5,868,896 - Robinson , et al. February 9, 1	1999-02-09
Isolation regions and methods of forming isolation regions Grant 5,834,358 - Pan , et al. November 10, 1	1998-11-10
Wafer backing member for mechanical and chemical-mechanical planarization of substrates Grant 5,830,806 - Hudson , et al. November 3, 1	1998-11-03
Planarization slurry including a dispersant and method of using same Grant 5,827,781 - Skrovan , et al. October 27, 1	1998-10-27
High-speed planarizing apparatus and method for chemical mechanical planarization of semiconductor wafers Grant 5,792,709 - Robinson , et al. August 11, 1	1998-08-11
Directional spray pad scrubber Grant 5,779,522 - Walker , et al. * July 14, 1	1998-07-14
Isolation regions and methods of forming isolation regions Grant 5,763,932 - Pan , et al. June 9, 1	1998-06-09
Polishing pad and method of use Grant 5,733,176 - Robinson , et al. March 31, 1	1998-03-31
Method and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substrates Grant 5,725,417 - Robinson March 10, 1	1998-03-10
Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers Grant 5,658,190 - Wright , et al. August 19, 1	1997-08-19
Wet clean for a surface having an exposed silicon/silica interface Grant 5,645,737 - Robinson , et al. July 8, 1	1997-07-08
Polishing pad and a method for making a polishing pad with covalently bonded particles Grant 5,624,303 - Robinson April 29, 1	1997-04-29
Directional spray pad scrubber Grant 5,616,069 - Walker , et al. April 1, 1	1997-04-01