Roberts; Stuart L.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Roberts; Stuart L..The latest application filed is for "packaged microdevices and methods for manufacturing packaged microdevices".

Company Profile

0.10.8

Roberts; Stuart L. - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaged microdevices and methods for manufacturing packaged microdevices Grant 8,987,885 - Roberts , et al. March 24, 2	2015-03-24
Packaged Microdevices And Methods For Manufacturing Packaged Microdevices App 20130193581 - Roberts; Stuart L. ; et al.	2013-08-01
Packaged microdevices and methods for manufacturing packaged microdevices Grant 8,354,301 - Roberts , et al. January 15, 2	2013-01-15
Wire bonders and methods of wire-bonding Grant 7,977,597 - Roberts , et al. July 12, 2	2011-07-12
Packaged Microdevices And Methods For Manufacturing Packaged Microdevices App 20110104857 - Roberts; Stuart L. ; et al.	2011-05-05
Packaged microdevices and methods for manufacturing packaged microdevices Grant 7,868,440 - Roberts , et al. January 11, 2	2011-01-11
Wire Bonders And Methods Of Wire-bonding App 20080053964 - Roberts; Stuart L. ; et al.	2008-03-06
Packaged microdevices and methods for manufacturing packaged microdevices App 20080048316 - Roberts; Stuart L. ; et al.	2008-02-28
Alignment and orientation features for a semiconductor package Grant 7,229,905 - Roberts , et al. June 12, 2	2007-06-12
Wire bonders and methods of wire-bonding Grant 7,227,095 - Roberts , et al. June 5, 2	2007-06-05
Alignment and orientation features for a semiconductor package App 20050148116 - Roberts, Stuart L. ; et al.	2005-07-07
Alignment and orientation features for a semiconductor package Grant 6,869,869 - Roberts , et al. March 22, 2	2005-03-22
Wire bonders and methods of wire-bonding App 20050029329 - Roberts, Stuart L. ; et al.	2005-02-10
Alignment and orientation features for a semiconductor package App 20030205795 - Roberts, Stuart L. ; et al.	2003-11-06
Method and apparatus for testing a semiconductor package Grant 6,628,136 - Roberts , et al. September 30, 2	2003-09-30
Alignment and orientation features for a semiconductor package Grant 6,577,019 - Roberts , et al. June 10, 2	2003-06-10
Method And Apparatus For Testing A Semiconductor Package App 20020024350 - ROBERTS, STUART L. ; et al.	2002-02-28

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.