Roberts; Carl M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Roberts; Carl M..The latest application filed is for "microphone system with silicon microphone secured to package lid".
- Roberts; Carl M. - Topsfield MA
| Patent | Date |
|---|---|
| Methods for packaging and sealing an integrated circuit die Grant 7,563,632 - Martin , et al. July 21, 2 | 2009-07-21 |
| Microphone System with Silicon Microphone Secured to Package Lid App 20080175425 - Roberts; Carl M. ; et al. | 2008-07-24 |
| Wafer level capped sensor Grant 7,357,017 - Felton , et al. April 15, 2 | 2008-04-15 |
| Wafer Level Capped Sensor App 20080009091 - Felton; Lawrence E. ; et al. | 2008-01-10 |
| Wafer level capped sensor Grant 7,275,424 - Felton , et al. October 2, 2 | 2007-10-02 |
| Wafer level capped sensor App 20050262929 - Felton, Lawrence E. ; et al. | 2005-12-01 |
| Wafer level capped sensor App 20050054133 - Felton, Lawrence E. ; et al. | 2005-03-10 |
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