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Patent applications and USPTO patent grants for Robbins; Carmencita I..The latest application filed is for "method for reconstructing an integrated circuit package using lapping".
Patent | Date |
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Method for reconstructing an integrated circuit package using lapping Grant 6,884,663 - Dlugokecki , et al. April 26, 2 | 2005-04-26 |
Method for deconstructing an integrated circuit package using lapping Grant 6,813,828 - Dlugokecki , et al. November 9, 2 | 2004-11-09 |
Method for deconstructing an integrated ciruit package using lapping App 20030126741 - Dlugokecki, Joseph J. ;   et al. | 2003-07-10 |
Method for reconstructing an integrated circuit package using lapping App 20030127423 - Dlugokecki, Joseph J. ;   et al. | 2003-07-10 |
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