Roane; Jerry M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Roane; Jerry M..The latest application filed is for "production vehicle for tritrack transportation system".

Company Profile

0.14.6

Roane; Jerry M. - Austin TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interactive computer simulation enhanced exercise machine Grant 7,497,812 - Neff , et al. March 3, 2	2009-03-03
Interactive computer simulation enhanced exercise machine Grant 7,497,807 - Neff , et al. March 3, 2	2009-03-03
Production Vehicle For Tritrack Transportation System App 20080110367 - Roane; Jerry M.	2008-05-15
Production vehicle for tritrack transportation system Grant 7,334,524 - Roane February 26, 2	2008-02-26
Interactive computer simulation enhanced exercise machine App 20070117680 - Neff; John D. ; et al.	2007-05-24
Interactive computer simulation enhanced exercise machine App 20070093360 - Neff; John D. ; et al.	2007-04-26
Production Vehicle For Tritrack Transportation System App 20070044678 - Roane; Jerry M.	2007-03-01
Tritrack system of mass transit Grant 7,127,999 - Roane October 31, 2	2006-10-31
Tritrack system of mass transit App 20050178284 - Roane, Jerry M.	2005-08-18
Tritrack system of mass transit Grant 6,923,124 - Roane August 2, 2	2005-08-02
Tritrack system of mass transit App 20040011242 - Roane, Jerry M.	2004-01-22
Warp-resistent ultra-thin integrated circuit package fabrication method Grant 6,194,247 - Burns , et al. February 27, 2	2001-02-27
High density integrated circuit module with complex electrical interconnect rails Grant 5,592,364 - Roane January 7, 1	1997-01-07
Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails Grant 5,588,205 - Roane December 31, 1	1996-12-31
Warp-resistant ultra-thin integrated circuit package Grant 5,581,121 - Burns , et al. December 3, 1	1996-12-03
Capacitive coupling configuration for an intergrated circuit package Grant 5,498,906 - Roane , et al. March 12, 1	1996-03-12
Method of assembling ultra high density integrated circuit packages Grant 5,475,920 - Burns , et al. December 19, 1	1995-12-19
Warp-resistent ultra-thin integrated circuit package fabrication method Grant 5,369,056 - Burns , et al. November 29, 1	1994-11-29
Impact solder method and apparatus Grant 5,236,117 - Roane , et al. August 17, 1	1993-08-17

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