loadpatents
name:-0.017795085906982
name:-0.010885000228882
name:-0.00047016143798828
Ro; Young-Hoon Patent Filings

Ro; Young-Hoon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ro; Young-Hoon.The latest application filed is for "printed circuit board and semiconductor package using the same".

Company Profile
0.10.13
  • Ro; Young-Hoon - Cheonan-si KR
  • Ro; Young-Hoon - Hwaseong-si N/A KR
  • Ro; Young-Hoon - Chungcheongnam-do KR
  • Ro; Young-Hoon - Gyeonggi-do KR
  • Ro; Young Hoon - Cheonan KR
  • Ro, Young Hoon - Cheonan-city KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Printed circuit board and semiconductor package using the same
Grant 9,502,341 - Song , et al. November 22, 2
2016-11-22
Printed Circuit Board And Semiconductor Package Using The Same
App 20160049379 - SONG; Jik-Ho ;   et al.
2016-02-18
Package on package
Grant 8,446,018 - Kim , et al. May 21, 2
2013-05-21
Helical springs electrical connecting a plurality of packages
Grant 8,274,144 - Ro September 25, 2
2012-09-25
Package Having Elastic Members For Vias, Package On Package Comprising The Same, And Methods Of Fabricating The Same
App 20120049348 - Ro; Young-Hoon
2012-03-01
Package On Package
App 20110215471 - Kim; Woo-Jae ;   et al.
2011-09-08
Universal PCB and smart card using the same
Grant 7,855,895 - Kim , et al. December 21, 2
2010-12-21
Universal Pcb And Smart Card Using The Same
App 20100038438 - Kim; Dong-Han ;   et al.
2010-02-18
Solid-state imaging apparatus and method for manufacturing the same
App 20090315130 - Ro; Young-Hoon ;   et al.
2009-12-24
Universal PCB and smart card using the same
Grant 7,630,209 - Kim , et al. December 8, 2
2009-12-08
Solid-state imaging apparatus, wiring substrate and methods of manufacturing the same
Grant 7,579,583 - Mok , et al. August 25, 2
2009-08-25
Image pickup device with non-molded DSP chip and manufacturing method
Grant 7,405,760 - Cho , et al. July 29, 2
2008-07-29
Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the same
App 20070015338 - Lee; Seok-Won ;   et al.
2007-01-18
Universal Pcb And Smart Card Using The Same
App 20070013396 - KIM; Dong-Han ;   et al.
2007-01-18
Solid-state imaging apparatus, wiring substrate and methods of manufacturing the same
App 20050116142 - Mok, Seung-Kon ;   et al.
2005-06-02
Semiconductor package having dam and method for fabricating the same
Grant 6,891,259 - Im , et al. May 10, 2
2005-05-10
Semiconductor package having DAM and method for fabricating the same
App 20040036183 - Im, Yun-Hyeok ;   et al.
2004-02-26
Image pickup device and manufacturing method thereof
App 20030234886 - Cho, Min Kyo ;   et al.
2003-12-25
Semiconductor chip package having one or more sealing screws
Grant 6,608,380 - Ro , et al. August 19, 2
2003-08-19
Semiconductor package having dam and method for fabricating the same
App 20030085475 - Im, Yun-Hyeok ;   et al.
2003-05-08
Semiconductor packages
App 20020113306 - Kwon, Heung Kyu ;   et al.
2002-08-22
Semiconductor chip package and manufacturing method thereof
App 20020041018 - Ro, Young-Hoon ;   et al.
2002-04-11

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