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Plurality of substrates bonded by direct bonding of copper recesses
Grant 9,865,545 - Rivoire , et al. January 9, 2 | 2018-01-09 |
Method Of Planarizing Recesses Filled With Copper
App 20170179035 - Rivoire; Maurice ; et al. | 2017-06-22 |
Method of planarizing recesses filled with copper
Grant 9,620,385 - Rivoire , et al. April 11, 2 | 2017-04-11 |
Method for modifying the crystalline structure of a copper element
Grant 9,620,412 - Di Cioccio , et al. April 11, 2 | 2017-04-11 |
Method Of Planarizing Recesses Filled With Copper
App 20150340269 - Rivoire; Maurice ; et al. | 2015-11-26 |
Simplified copper-copper bonding
Grant 8,647,983 - Di Cioccio , et al. February 11, 2 | 2014-02-11 |
Method for forming porous material in microcavity or micropassage by mechanicochemical polishing
Grant 8,562,934 - Coiffic , et al. October 22, 2 | 2013-10-22 |
Method for producing a membrane comprising micropassages made from porous material by chemical mechanical polishing
Grant 8,323,733 - Coiffic , et al. December 4, 2 | 2012-12-04 |
Method For Modifying The Crystalline Structure Of A Copper Element
App 20120097296 - Di Cioccio; Lea ; et al. | 2012-04-26 |
Simplified Copper-copper Bonding
App 20120100657 - Di Cioccio; Lea ; et al. | 2012-04-26 |
Method For Forming Porous Material In Microcavity Or Micropassage By Mechanicochemical Polishing
App 20110034329 - Coiffic; Jean-Christophe ; et al. | 2011-02-10 |
Light sensor located above an integrated circuit
Grant 7,713,766 - Thomas , et al. May 11, 2 | 2010-05-11 |
Method for producing a membrane comprising micropassages made from porous material by chemical mechanical polishing
App 20090252871 - Coiffic; Jean-Christophe ; et al. | 2009-10-08 |
Light Sensor Located Above An Integrated Circuit
App 20090075410 - Thomas; Danielle ; et al. | 2009-03-19 |
Light sensor located above an integrated circuit
Grant 7,492,026 - Thomas , et al. February 17, 2 | 2009-02-17 |
Abrasive composition for the integrated circuit electronics industry
Grant 7,252,695 - Jacquinot , et al. August 7, 2 | 2007-08-07 |
Method of making a variable capacitor component
Grant 7,200,908 - Cassett , et al. April 10, 2 | 2007-04-10 |
New abrasive composition for the integrated circuit electronics industry
App 20070051918 - Jacquinot; Eric ; et al. | 2007-03-08 |
Abrasive composition for the integrated circuits electronics industry
Grant 7,144,814 - Jacquinot , et al. December 5, 2 | 2006-12-05 |
Component comprising a variable capacitor
App 20060213044 - Casset; Fabrice ; et al. | 2006-09-28 |
Light sensor located above an integrated circuit
App 20060145282 - Thomas; Danielle ; et al. | 2006-07-06 |
Component Comprising A Variable Capacitor
App 20060114638 - Casset; Fabrice ; et al. | 2006-06-01 |
Method for planarizing organosilicate layers
App 20020160692 - Rivoire, Maurice ; et al. | 2002-10-31 |
Abrasive Composition For The Integrated Circuits Electronics Industry
App 20020142600 - JACQUINOT, ERIC ; et al. | 2002-10-03 |
Process for obtaining a layer of single-crystal germanium or silicon on a substrate of single-crystal silicon or germanium, respectively, and multilayer products obtained
Grant 6,429,098 - Bensahel , et al. August 6, 2 | 2002-08-06 |
Process for mechanical chemical polishing of a layer in a copper-based material
Grant 6,302,765 - Jacquinot , et al. October 16, 2 | 2001-10-16 |
Process for obtaining a layer of single-crystal germanium or silicon on a substrate of single-crystal silicon or germanium, respectively
Grant 6,117,750 - Bensahel , et al. September 12, 2 | 2000-09-12 |
Method of pretreating the deposition chamber and/or the substrate for the selective deposition of tungsten
Grant 5,431,964 - Rivoire July 11, 1 | 1995-07-11 |
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