Rita; Robert A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rita; Robert A..The latest application filed is for "low loss glass-ceramic materials, method of making same and electronic packages including same".

Company Profile

0.18.11

Rita; Robert A. - Manlius NY
Rita; Robert A. - Wappingers Falls NY
Rita; Robert A. - Wappinger Falls NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polyimide compositions and use thereof in ceramic product defect repair Grant 7,608,295 - Sachdev , et al. October 27, 2	2009-10-27
Low Loss Glass-ceramic Materials, Method Of Making Same And Electronic Packages Including Same App 20080245467 - RITA; Robert A.	2008-10-09
Low loss glass-ceramic materials, method of making same and electronic packages including same Grant 7,387,838 - Rita June 17, 2	2008-06-17
Electronic package repair process Grant 7,294,909 - Casey , et al. November 13, 2	2007-11-13
Polyimide Compositions And Use Thereof In Ceramic Product Defect Repair App 20070154631 - Sachdev; Krishna G. ; et al.	2007-07-05
Glass-ceramic materials and electronic packages including same Grant 7,186,461 - Rita March 6, 2	2007-03-06
Glass-ceramic materials and electronic packages including same App 20050266251 - Rita, Robert A.	2005-12-01
Low loss glass-ceramic materials, method of making same and electronic packages including same App 20050266252 - Rita, Robert A.	2005-12-01
Electronic package repair process App 20050176255 - Casey, Jon A. ; et al.	2005-08-11
Electronic package repair process Grant 6,916,670 - Casey , et al. July 12, 2	2005-07-12
Method of selective plating on a substrate Grant 6,823,585 - LaPlante , et al. November 30, 2	2004-11-30
Selective plating using dual lift-off mask App 20040187303 - LaPlante, Mark J. ; et al.	2004-09-30
Electronic package repair process App 20040148765 - Casey, Jon A. ; et al.	2004-08-05
Polyimide compositions and use thereof in ceramic product defect repair App 20040132900 - Sachdev, Krishna G. ; et al.	2004-07-08
Apparatus and method for repairing electronic packages Grant 6,713,686 - Becker , et al. March 30, 2	2004-03-30
Apparatus and method for repairing electronic packages App 20030136581 - Becker, Wiren D. ; et al.	2003-07-24
High k dielectric material with low k dielectric sheathed signal vias Grant 6,430,030 - Farooq , et al. August 6, 2	2002-08-06
Process For Screening Features On An Electronic Substrate With A Low Viscosity Paste App 20020009539 - CASEY, JON A. ; et al.	2002-01-24
Method for making high k dielectric material with low k dielectric sheathed signal vias App 20010011571 - Farooq, Mukta S. ; et al.	2001-08-09
Method for a thin film multilayer capacitor Grant 6,216,324 - Farooq , et al. April 17, 2	2001-04-17
Method for forming a perovskite thin film using a sputtering method with a fully oxidized perovskite target Grant 6,210,545 - Farooq , et al. April 3, 2	2001-04-03
Method for making high k dielectric material with low k dielectric sheathed signal vias Grant 6,200,400 - Farooq , et al. March 13, 2	2001-03-13
Low loss glass ceramic composition with modifiable dielectric constant Grant 6,171,988 - Fasano , et al. January 9, 2	2001-01-09
Pastes for improved substrate dimensional control Grant 6,117,367 - Bezama , et al. September 12, 2	2000-09-12
High k dielectric capacitor with low k sheathed signal vias Grant 6,072,690 - Farooq , et al. June 6, 2	2000-06-06
Structure for a thin film multilayer capacitor Grant 6,023,407 - Farooq , et al. February 8, 2	2000-02-08
Edge seal technology for low dielectric/porous substrate processing Grant 5,489,465 - Natarajan , et al. February 6, 1	1996-02-06
Process for producing ceramic circuit structures having conductive vias Grant 5,337,475 - Aoude , et al. August 16, 1	1994-08-16
Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates Grant 5,283,104 - Aoude , et al. February 1, 1	1994-02-01

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