Rinne; Glenn A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rinne; Glenn A..The latest application filed is for "electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers".

Company Profile

0.44.26

Rinne; Glenn A. - Taipei TW
Rinne; Glenn A. - Apex NC
Rinne; Glenn A. - Cary NC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and manufacturing method thereof Grant 10,483,222 - Paek , et al. Nov	2019-11-19
Semiconductor device and manufacturing method thereof Grant 9,524,906 - Paek , et al. December 20, 2	2016-12-20
Wafers including patterned back side layers thereon Grant 8,643,177 - Rinne , et al. February 4, 2	2014-02-04
Electronic structures including barrier layers and/or oxidation barriers defining lips and related methods Grant 8,487,432 - Rinne , et al. July 16, 2	2013-07-16
Semiconductor device and manufacturing method thereof Grant 8,362,612 - Paek , et al. January 29, 2	2013-01-29
Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers Grant 8,294,269 - Nair , et al. October 23, 2	2012-10-23
Lead free alloy bump structure and fabrication method Grant 7,994,043 - Mis , et al. August 9, 2	2011-08-09
Electronic devices including solder bumps on compliant dielectric layers Grant 7,932,615 - Rinne April 26, 2	2011-04-26
Electronic Structures Including Conductive Layers Comprising Copper and Having a Thickness of at Least 0.5 Micrometers App 20110084392 - Nair; Krishna K. ; et al.	2011-04-14
Methods of Forming Back Side Layers For Thinned Wafers and Related Structures App 20110079901 - Rinne; Glenn A. ; et al.	2011-04-07
Electronic Structures Including Barrier Layers and/or Oxidation Barriers Defining Lips and Related Methods App 20110037171 - Rinne; Glenn A. ; et al.	2011-02-17
Methods of forming electronic structures including conductive shunt layers and related structures Grant 7,879,715 - Nair , et al. February 1, 2	2011-02-01
Methods of forming back side layers for thinned wafers Grant 7,871,899 - Rinne , et al. January 18, 2	2011-01-18
Electronic structures including barrier layers defining lips Grant 7,834,454 - Rinne , et al. November 16, 2	2010-11-16
Capacitor and resistor having anodic metal and anodic metal oxide structure Grant 7,755,164 - Rinne July 13, 2	2010-07-13
Methods of forming metal layers using multi-layer lift-off patterns Grant 7,674,701 - Rinne March 9, 2	2010-03-09
Solder structures for out of plane connections Grant 7,659,621 - Rinne February 9, 2	2010-02-09
Non-Circular via holes for bumping pads and related structures Grant 7,531,898 - Batchelor , et al. May 12, 2	2009-05-12
Stacked electronic structures including offset substrates Grant 7,495,326 - Rinne February 24, 2	2009-02-24
Electronic Structures Including Barrier Layers Defining Lips App 20080308931 - Rinne; Glenn A. ; et al.	2008-12-18
Methods of forming bumps using barrier layers as etch masks Grant 7,427,557 - Rinne , et al. September 23, 2	2008-09-23
Methods Of Forming Electronic Structures Including Conductive Shunt Layers And Related Structures App 20080026560 - Nair; Krishna K. ; et al.	2008-01-31
Methods of forming electronic structures including conductive shunt layers and related structures Grant 7,297,631 - Nair , et al. November 20, 2	2007-11-20
Methods of Forming Metal Layers Using Multi-Layer Lift-Off Patterns App 20070184643 - Rinne; Glenn A.	2007-08-09
Methods of Forming Electronic Interconnections Including Compliant Dielectric Layers and Related Devices App 20070182004 - Rinne; Glenn A.	2007-08-09
Methods of Forming Back Side Layers for Thinned Wafers and Related Structures App 20070161234 - Rinne; Glenn A. ; et al.	2007-07-12
Optical Structures Including Liquid Bumps App 20070152020 - Rinne; Glenn A.	2007-07-05
Optical structures including liquid bumps and related methods Grant 7,213,740 - Rinne May 8, 2	2007-05-08
Low temperature methods of bonding components and related structures App 20070040003 - Rinne; Glenn A. ; et al.	2007-02-22
Low temperature methods of bonding components and related structures Grant 7,156,284 - Rinne , et al. January 2, 2	2007-01-02
Methods of forming self-healing metal-insulator-metal (MIM) structures and related devices App 20060205170 - Rinne; Glenn A.	2006-09-14
Solder structures for out of plane connections App 20060138675 - Rinne; Glenn A.	2006-06-29
Methods of providing solder structures for out plane connections Grant 7,049,216 - Rinne May 23, 2	2006-05-23
Methods of positioning components using liquid prime movers and related structures Grant 7,032,806 - Rinne April 25, 2	2006-04-25
Non-circular via holes for bumping pads and related structures App 20060076679 - Batchelor; William E. ; et al.	2006-04-13
Methods of forming electronic structures including conductive shunt layers and related structures App 20060009023 - Nair; Krishna K. ; et al.	2006-01-12
Optical structures including liquid bumps and related methods App 20050279809 - Rinne, Glenn A.	2005-12-22
Electronic structures including conductive shunt layers Grant 6,960,828 - Nair , et al. November 1, 2	2005-11-01
Methods of forming bumps using barrier layers as etch masks and related structures App 20050215045 - Rinne, Glenn A. ; et al.	2005-09-29
Solder structures for out of plane connections and related methods App 20050136641 - Rinne, Glenn A.	2005-06-23
Low temperature methods of bonding components Grant 6,863,209 - Rinne , et al. March 8, 2	2005-03-08
Electroplating methods including maintaining a determined electroplating voltage and related systems Grant 6,793,792 - Jones , et al. September 21, 2	2004-09-21
Low temperature methods of bonding components and related structures App 20040169064 - Rinne, Glenn A. ; et al.	2004-09-02
Stacked electronic structures including offset substrates App 20040124520 - Rinne, Glenn A.	2004-07-01
Methods of forming electronic structures including conductive shunt layers and related structures App 20040053483 - Nair, Krishna K. ; et al.	2004-03-18
Methods and systems for positioning substrates using spring force of phase-changeable bumps therebetween Grant 6,666,368 - Rinne December 23, 2	2003-12-23
Trilayer/bilayer solder bumps and fabrication methods therefor Grant 6,492,197 - Rinne December 10, 2	2002-12-10
Methods of positioning components using liquid prime movers and related structures App 20020153092 - Rinne, Glenn A.	2002-10-24
Methods and systems for positioning substrates using spring force of phase-changeable bumps therebetween App 20020109000 - Rinne, Glenn A.	2002-08-15
Electroplating methods including maintaining a determined electroplating voltage and related systems App 20020092771 - Jones, Curtis Grant ; et al.	2002-07-18
Microelectronic packages in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles Grant 6,418,033 - Rinne July 9, 2	2002-07-09
Low temperature methods of bonding components and related structures App 20020074381 - Rinne, Glenn A. ; et al.	2002-06-20
Controlled-shaped solder reservoirs for increasing the volume of solder bumps Grant 6,392,163 - Rinne , et al. May 21, 2	2002-05-21
Methods for forming integrated redistribution routing conductors and solder bumps Grant 6,389,691 - Rinne , et al. May 21, 2	2002-05-21
Methods and systems for attaching substrates to one another using solder structures having portions with different melting points App 20020056742 - Rinne, Glenn A.	2002-05-16
Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby Grant 6,388,203 - Rinne , et al. May 14, 2	2002-05-14
Controlled-shaped Solder Reservoirs For Increasing The Volume Of Solder Bumps App 20020020551 - Rinne, Glenn A. ; et al.	2002-02-21
Key-shaped solder bumps and under bump metallurgy Grant 6,329,608 - Rinne , et al. December 11, 2	2001-12-11
Methods for modulating a radiation signal Grant 6,233,088 - Roberson , et al. May 15, 2	2001-05-15
Methods of electroplating solder bumps of uniform height on integrated circuit substrates Grant 6,117,299 - Rinne , et al. September 12, 2	2000-09-12
Microelectronic radiation detectors for detecting and emitting radiation signals Grant 5,990,472 - Rinne November 23, 1	1999-11-23
Microelectronic packaging using arched solder columns Grant 5,963,793 - Rinne , et al. October 5, 1	1999-10-05
Solder bumps and structures for integrated redistribution routing conductors Grant 5,892,179 - Rinne , et al. April 6, 1	1999-04-06
Recessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon Grant 5,447,264 - Koopman , et al. September 5, 1	1995-09-05
Method of forming differing volume solder bumps Grant 5,381,946 - Koopman , et al. January 17, 1	1995-01-17
Apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon Grant 5,374,893 - Koopman , et al. December 20, 1	1994-12-20
Method for testing, burn-in, and/or programming of integrated circuit chips Grant 5,289,631 - Koopman , et al. March 1, 1	1994-03-01

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