RINKIO; Marcus
Patent Applications and Registrations
Patent applications and USPTO patent grants for RINKIO; Marcus.The latest application filed is for "method for bonding wafers, and a wafer".
- RINKIO; Marcus - Rajamaki FI
- Rinkio; Marcus - Jyvaskyla FI
| Patent | Date |
|---|---|
| Method For Bonding Wafers, And A Wafer App 20220289567 - HANNULA; Konsta ; et al. | 2022-09-15 |
| Electrode for a microelectromechanical device Grant 10,284,142 - Rinkio | 2019-05-07 |
| Micromechanical gyroscope structure Grant 9,891,052 - Rinkio February 13, 2 | 2018-02-13 |
| Electrode For A Microelectromechanical Device App 20170207748 - RINKIO; Marcus | 2017-07-20 |
| Gyroscope structure and gyroscope with improved quadrature compensation Grant 9,631,928 - Rinkio , et al. April 25, 2 | 2017-04-25 |
| Microelectromechanical resonator Grant 9,412,934 - Iihola , et al. August 9, 2 | 2016-08-09 |
| Micromechanical Gyroscope Structure App 20160187137 - RINKIO; Marcus | 2016-06-30 |
| Gyroscope Structure And Gyroscope With Improved Quadrature Compensation App 20150082885 - RINKIO; Marcus ; et al. | 2015-03-26 |
| Microelectromechanical Resonator App 20140339963 - IIHOLA; Antti ; et al. | 2014-11-20 |
| Method and device for monitoring the condition of a medium App 20100045989 - Vanhanen; Jarmo ; et al. | 2010-02-25 |
| Method and device for monitoring the condition of a medium App 20090310138 - Vanhanen; Jarmo ; et al. | 2009-12-17 |
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