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name:-0.030225038528442
name:-0.031960964202881
name:-0.0018739700317383
Ring; Zoltan Patent Filings

Ring; Zoltan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ring; Zoltan.The latest application filed is for "method of forming vias in silicon carbide and resulting devices and circuits".

Company Profile
1.29.24
  • Ring; Zoltan - Durham NC US
  • Ring; Zoltan - Chapel Hill NC
  • Ring; Zoltan - Chappel Hill NC
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Nitride-based transistors with a protective layer and a low-damage recess
Grant 11,316,028 - Sheppard , et al. April 26, 2
2022-04-26
Method of forming vias in silicon carbide and resulting devices and circuits
Grant 10,367,074 - Ring , et al. July 30, 2
2019-07-30
Stress mitigation for thin and thick films used in semiconductor circuitry
Grant 9,934,983 - Ring , et al. April 3, 2
2018-04-03
Encapsulation of advanced devices using novel PECVD and ALD schemes
Grant 9,812,338 - Ring , et al. November 7, 2
2017-11-07
PECVD protective layers for semiconductor devices
Grant 9,761,439 - Ring , et al. September 12, 2
2017-09-12
Contact pad
Grant 9,607,955 - Mieczkowski , et al. March 28, 2
2017-03-28
Method Of Forming Vias In Silicon Carbide And Resulting Devices And Circuits
App 20170012106 - Ring; Zoltan ;   et al.
2017-01-12
Devices including ultra-short gates and methods of forming same
Grant 9,530,647 - Ring , et al. December 27, 2
2016-12-27
Method of forming vias in silicon carbide and resulting devices and circuits
Grant 9,490,169 - Ring , et al. November 8, 2
2016-11-08
Pecvd Protective Layers For Semiconductor Devices
App 20160172315 - Ring; Zoltan ;   et al.
2016-06-16
Using stress reduction barrier sub-layers in a semiconductor die
Grant 9,269,662 - Ring , et al. February 23, 2
2016-02-23
Multilayer diffusion barriers for wide bandgap Schottky barrier devices
Grant 9,142,631 - Mieczkowski , et al. September 22, 2
2015-09-22
Stress Mitigation For Thin And Thick Films Used In Semiconductor Circuitry
App 20150221574 - Ring; Zoltan ;   et al.
2015-08-06
Hydrogen mitigation schemes in the passivation of advanced devices
Grant 8,994,073 - Hagleitner , et al. March 31, 2
2015-03-31
Devices Including Ultra-short Gates And Methods Of Forming Same
App 20150084116 - Ring; Zoltan ;   et al.
2015-03-26
Encapsulation Of Advanced Devices Using Novel Pecvd And Ald Schemes
App 20140264960 - Ring; Zoltan ;   et al.
2014-09-18
Using Stress Reduction Barrier Sub-layers In A Semiconductor Die
App 20140103363 - Ring; Zoltan ;   et al.
2014-04-17
Hydrogen Mitigation Schemes In The Passivation Of Advanced Devices
App 20140097469 - Hagleitner; Helmut ;   et al.
2014-04-10
Methods of forming contact structures including alternating metal and silicon layers and related devices
Grant 8,563,372 - Hagleitner , et al. October 22, 2
2013-10-22
Method of forming vias in silicon carbide and resulting devices and circuits
Grant 8,202,796 - Ring , et al. June 19, 2
2012-06-19
Contact Pad
App 20120115319 - Mieczkowski; Van ;   et al.
2012-05-10
Multilayer Diffusion Barriers For Wide Bandgap Schottky Barrier Devices
App 20110227089 - Mieczkowski; Van ;   et al.
2011-09-22
Methods of Forming Contact Structures Including Alternating Metal and Silicon Layers and Related Devices
App 20110193135 - Hagleitner; Helmut ;   et al.
2011-08-11
Method Of Forming Vias In Silicon Carbide And Resulting Devices And Circuits
App 20110165771 - Ring; Zoltan ;   et al.
2011-07-07
Nitride-Based Transistors With a Protective Layer and a Low-Damage Recess
App 20110140123 - Sheppard; Scott T. ;   et al.
2011-06-16
Method Of Forming Vias In Silicon Carbide And Resulting Devices And Circuits
App 20110108855 - Ring; Zoltan ;   et al.
2011-05-12
Nitride-based transistors with a protective layer and a low-damage recess
Grant 7,906,799 - Sheppard , et al. March 15, 2
2011-03-15
Method of forming vias in silicon carbide and resulting devices and circuits
Grant 7,892,974 - Ring , et al. February 22, 2
2011-02-22
Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides
Grant 7,858,460 - Ring , et al. December 28, 2
2010-12-28
Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides
Grant 7,855,401 - Sheppard , et al. December 21, 2
2010-12-21
Passivation of Wide Band-Gap Based Semiconductor Devices with Hydrogen-Free Sputtered Nitrides
App 20090215280 - Ring; Zoltan ;   et al.
2009-08-27
Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides
Grant 7,525,122 - Ring , et al. April 28, 2
2009-04-28
Method of Forming Vias in Silicon Carbide and Resulting Devices and Circuits
App 20090104738 - Ring; Zoltan ;   et al.
2009-04-23
Diffusion Barrier For Light Emitting Diodes
App 20080042145 - Hagleitner; Helmut ;   et al.
2008-02-21
Passivation of Wide Band-Gap Based Semiconductor Devices with Hydrogen-Free Sputtered Nitrides
App 20080035934 - Sheppard; Scott T. ;   et al.
2008-02-14
Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides
App 20070001174 - Ring; Zoltan ;   et al.
2007-01-04
Nitride-based transistors with a protective layer and a low-damage recess
App 20060255366 - Sheppard; Scott T. ;   et al.
2006-11-16
Method of forming vias in silicon carbide and resulting devices and circuits
Grant 7,125,786 - Ring , et al. October 24, 2
2006-10-24
Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof
Grant 7,045,404 - Sheppard , et al. May 16, 2
2006-05-16
Method of forming vias in silicon carbide and resulting devices and circuits
App 20060065910 - Ring; Zoltan ;   et al.
2006-03-30
Layered semiconductor devices with conductive vias
Grant 6,946,739 - Ring September 20, 2
2005-09-20
Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof
App 20050170574 - Sheppard, Scott T. ;   et al.
2005-08-04
Method of Forming Vias in Silicon Carbide and Resulting Devices and Circuits
App 20040241970 - Ring, Zoltan
2004-12-02
Method of forming vias in silicon carbide and resulting devices and circuits
Grant 6,649,497 - Ring November 18, 2
2003-11-18
Method of forming vias in silicon carbide and resulting devices and circuits
Grant 6,515,303 - Ring February 4, 2
2003-02-04
Method of forming vias in silicon carbide and resulting devices and circuits
Grant 6,475,889 - Ring November 5, 2
2002-11-05
Method of forming vias in silicon carbide and resulting devices and circuits
App 20020066960 - Ring, Zoltan
2002-06-06
Method of forming vias in silicon carbide and resulting devices and circuits
App 20020055265 - Ring, Zoltan
2002-05-09

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