Patent | Date |
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Nitride-based transistors with a protective layer and a low-damage recess Grant 11,316,028 - Sheppard , et al. April 26, 2 | 2022-04-26 |
Method of forming vias in silicon carbide and resulting devices and circuits Grant 10,367,074 - Ring , et al. July 30, 2 | 2019-07-30 |
Stress mitigation for thin and thick films used in semiconductor circuitry Grant 9,934,983 - Ring , et al. April 3, 2 | 2018-04-03 |
Encapsulation of advanced devices using novel PECVD and ALD schemes Grant 9,812,338 - Ring , et al. November 7, 2 | 2017-11-07 |
PECVD protective layers for semiconductor devices Grant 9,761,439 - Ring , et al. September 12, 2 | 2017-09-12 |
Contact pad Grant 9,607,955 - Mieczkowski , et al. March 28, 2 | 2017-03-28 |
Method Of Forming Vias In Silicon Carbide And Resulting Devices And Circuits App 20170012106 - Ring; Zoltan ;   et al. | 2017-01-12 |
Devices including ultra-short gates and methods of forming same Grant 9,530,647 - Ring , et al. December 27, 2 | 2016-12-27 |
Method of forming vias in silicon carbide and resulting devices and circuits Grant 9,490,169 - Ring , et al. November 8, 2 | 2016-11-08 |
Pecvd Protective Layers For Semiconductor Devices App 20160172315 - Ring; Zoltan ;   et al. | 2016-06-16 |
Using stress reduction barrier sub-layers in a semiconductor die Grant 9,269,662 - Ring , et al. February 23, 2 | 2016-02-23 |
Multilayer diffusion barriers for wide bandgap Schottky barrier devices Grant 9,142,631 - Mieczkowski , et al. September 22, 2 | 2015-09-22 |
Stress Mitigation For Thin And Thick Films Used In Semiconductor Circuitry App 20150221574 - Ring; Zoltan ;   et al. | 2015-08-06 |
Hydrogen mitigation schemes in the passivation of advanced devices Grant 8,994,073 - Hagleitner , et al. March 31, 2 | 2015-03-31 |
Devices Including Ultra-short Gates And Methods Of Forming Same App 20150084116 - Ring; Zoltan ;   et al. | 2015-03-26 |
Encapsulation Of Advanced Devices Using Novel Pecvd And Ald Schemes App 20140264960 - Ring; Zoltan ;   et al. | 2014-09-18 |
Using Stress Reduction Barrier Sub-layers In A Semiconductor Die App 20140103363 - Ring; Zoltan ;   et al. | 2014-04-17 |
Hydrogen Mitigation Schemes In The Passivation Of Advanced Devices App 20140097469 - Hagleitner; Helmut ;   et al. | 2014-04-10 |
Methods of forming contact structures including alternating metal and silicon layers and related devices Grant 8,563,372 - Hagleitner , et al. October 22, 2 | 2013-10-22 |
Method of forming vias in silicon carbide and resulting devices and circuits Grant 8,202,796 - Ring , et al. June 19, 2 | 2012-06-19 |
Contact Pad App 20120115319 - Mieczkowski; Van ;   et al. | 2012-05-10 |
Multilayer Diffusion Barriers For Wide Bandgap Schottky Barrier Devices App 20110227089 - Mieczkowski; Van ;   et al. | 2011-09-22 |
Methods of Forming Contact Structures Including Alternating Metal and Silicon Layers and Related Devices App 20110193135 - Hagleitner; Helmut ;   et al. | 2011-08-11 |
Method Of Forming Vias In Silicon Carbide And Resulting Devices And Circuits App 20110165771 - Ring; Zoltan ;   et al. | 2011-07-07 |
Nitride-Based Transistors With a Protective Layer and a Low-Damage Recess App 20110140123 - Sheppard; Scott T. ;   et al. | 2011-06-16 |
Method Of Forming Vias In Silicon Carbide And Resulting Devices And Circuits App 20110108855 - Ring; Zoltan ;   et al. | 2011-05-12 |
Nitride-based transistors with a protective layer and a low-damage recess Grant 7,906,799 - Sheppard , et al. March 15, 2 | 2011-03-15 |
Method of forming vias in silicon carbide and resulting devices and circuits Grant 7,892,974 - Ring , et al. February 22, 2 | 2011-02-22 |
Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides Grant 7,858,460 - Ring , et al. December 28, 2 | 2010-12-28 |
Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides Grant 7,855,401 - Sheppard , et al. December 21, 2 | 2010-12-21 |
Passivation of Wide Band-Gap Based Semiconductor Devices with Hydrogen-Free Sputtered Nitrides App 20090215280 - Ring; Zoltan ;   et al. | 2009-08-27 |
Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides Grant 7,525,122 - Ring , et al. April 28, 2 | 2009-04-28 |
Method of Forming Vias in Silicon Carbide and Resulting Devices and Circuits App 20090104738 - Ring; Zoltan ;   et al. | 2009-04-23 |
Diffusion Barrier For Light Emitting Diodes App 20080042145 - Hagleitner; Helmut ;   et al. | 2008-02-21 |
Passivation of Wide Band-Gap Based Semiconductor Devices with Hydrogen-Free Sputtered Nitrides App 20080035934 - Sheppard; Scott T. ;   et al. | 2008-02-14 |
Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides App 20070001174 - Ring; Zoltan ;   et al. | 2007-01-04 |
Nitride-based transistors with a protective layer and a low-damage recess App 20060255366 - Sheppard; Scott T. ;   et al. | 2006-11-16 |
Method of forming vias in silicon carbide and resulting devices and circuits Grant 7,125,786 - Ring , et al. October 24, 2 | 2006-10-24 |
Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof Grant 7,045,404 - Sheppard , et al. May 16, 2 | 2006-05-16 |
Method of forming vias in silicon carbide and resulting devices and circuits App 20060065910 - Ring; Zoltan ;   et al. | 2006-03-30 |
Layered semiconductor devices with conductive vias Grant 6,946,739 - Ring September 20, 2 | 2005-09-20 |
Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof App 20050170574 - Sheppard, Scott T. ;   et al. | 2005-08-04 |
Method of Forming Vias in Silicon Carbide and Resulting Devices and Circuits App 20040241970 - Ring, Zoltan | 2004-12-02 |
Method of forming vias in silicon carbide and resulting devices and circuits Grant 6,649,497 - Ring November 18, 2 | 2003-11-18 |
Method of forming vias in silicon carbide and resulting devices and circuits Grant 6,515,303 - Ring February 4, 2 | 2003-02-04 |
Method of forming vias in silicon carbide and resulting devices and circuits Grant 6,475,889 - Ring November 5, 2 | 2002-11-05 |
Method of forming vias in silicon carbide and resulting devices and circuits App 20020066960 - Ring, Zoltan | 2002-06-06 |
Method of forming vias in silicon carbide and resulting devices and circuits App 20020055265 - Ring, Zoltan | 2002-05-09 |