Rinck; Helmut

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rinck; Helmut.The latest application filed is for "etching platinum-containing thin film using protective cap layer".

Company Profile

5.9.10

Rinck; Helmut - Moosburg DE
Rinck; Helmut - Gammelsdorf DE
Rinck; Helmut - Bavaria DE
Rinck; Helmut - Langenbach DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Etching Platinum-containing Thin Film Using Protective Cap Layer App 20210313179 - Meier; Sebastian ; et al.	2021-10-07
Patterning Platinum By Alloying And Etching Platinum Alloy App 20210242029 - Meier; Sebastian ; et al.	2021-08-05
Etching platinum-containing thin film using protective cap layer Grant 11,069,530 - Meier , et al. July 20, 2	2021-07-20
Patterning platinum by alloying and etching platinum alloy Grant 11,011,381 - Meier , et al. May 18, 2	2021-05-18
Electronic device having cobalt coated aluminum contact pads Grant 10,714,439 - Dadvand , et al.	2020-07-14
Etching Platinum-containing Thin Film Using Protective Cap Layer App 20200083050 - Meier; Sebastian ; et al.	2020-03-12
Patterning Platinum By Alloying And Etching Platinum Alloy App 20200035500 - Meier; Sebastian ; et al.	2020-01-30
Etching platinum-containing thin film using protective cap layer Grant 10,504,733 - Meier , et al. Dec	2019-12-10
Sacrificial layer for platinum patterning Grant 10,297,497 - Meier , et al.	2019-05-21
Electronic Device Having Coated Contact Pads App 20190109104 - DADVAND; NAZILLA ; et al.	2019-04-11
Metal Bond Pad With Cobalt Interconnect Layer And Solder Thereon App 20180218993 - RINCK; HELMUT ; et al.	2018-08-02
Sacrificial Layer For Platinum Patterning App 20180204767 - MEIER; Sebastian ; et al.	2018-07-19
Etching Platinum-containing Thin Film Using Protective Cap Layer App 20180204734 - Meier; Sebastian ; et al.	2018-07-19
Metal bond pad with cobalt interconnect layer and solder thereon Grant 9,960,135 - Rinck , et al. May 1, 2	2018-05-01
Metal Bond Pad With Cobalt Interconnect Layer And Solder Thereon App 20160284656 - RINCK; HELMUT ; et al.	2016-09-29
Integrated circuit (IC) having electrically conductive corrosion protecting cap over bond pads Grant 9,230,852 - Rinck , et al. January 5, 2	2016-01-05
Integrated Circuit (ic) Having Electrically Conductive Corrosion Protecting Cap Over Bond Pads App 20140239500 - RINCK; HELMUT ; et al.	2014-08-28
Method of measuring the contact angle of wetting liquid on a solid surface Grant 5,080,484 - Schneider , et al. January 14, 1	1992-01-14
Method for etching an electrically conductive layer applied to a substrate Grant 4,969,973 - Rinck , et al. November 13, 1	1990-11-13

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