Rigg; Sidney B.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rigg; Sidney B..The latest application filed is for "through-wafer interconnects for photoimager and memory wafers".

Company Profile

0.32.32

Rigg; Sidney B. - Meridian ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Through-wafer interconnects for photoimager and memory wafers Grant 8,669,179 - Akram , et al. March 11, 2	2014-03-11
Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate Grant 8,637,962 - Akram , et al. January 28, 2	2014-01-28
Through-wafer Interconnects For Photoimager And Memory Wafers App 20130295766 - Akram; Salman ; et al.	2013-11-07
Through-wafer interconnects for photoimager and memory wafers Grant 8,502,353 - Akram , et al. August 6, 2	2013-08-06
Semiconductor Dice Including At Least One Blind Hole, Wafers Including Such Semiconductor Dice, And Intermediate Products Made While Forming At Least One Blind Hole In A Substrate App 20130043588 - Akram; Salman ; et al.	2013-02-21
Methods of forming conductive vias Grant 8,324,100 - Akram , et al. December 4, 2	2012-12-04
Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate Grant 8,324,101 - Akram , et al. December 4, 2	2012-12-04
Methods for fabricating and filling conductive vias and conductive vias so formed Grant 8,294,273 - Akram , et al. October 23, 2	2012-10-23
Semiconductor Dice Including At Least One Blind Hole, Wafers Including Such Semiconductor Dice, And Intermediate Products Made While Forming At Least One Blind Hole In A Substrate App 20110272806 - Akram; Salman ; et al.	2011-11-10
Methods of forming blind wafer interconnects, and related structures and assemblies Grant 7,989,345 - Akram , et al. August 2, 2	2011-08-02
Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates Grant 7,960,829 - Wood , et al. June 14, 2	2011-06-14
Methods Of Forming Conductive Vias App 20110136336 - Akram; Salman ; et al.	2011-06-09
Through-wafer interconnects for photoimager and memory wafers Grant 7,956,443 - Akram , et al. June 7, 2	2011-06-07
Methods For Fabricating And Filling Conductive Vias And Conductive Vias So Formed App 20110095429 - Akram; Salman ; et al.	2011-04-28
Methods for fabricating and filling conductive vias and conductive vias so formed Grant 7,892,972 - Akram , et al. February 22, 2	2011-02-22
Microelectronic devices and methods for forming interconnects in microelectronic devices Grant 7,829,976 - Kirby , et al. November 9, 2	2010-11-09
Methods of forming blind wafer interconnects Grant 7,772,116 - Akram , et al. August 10, 2	2010-08-10
Microelectronics devices, having vias, and packaged microelectronic devices having vias Grant 7,759,800 - Rigg , et al. July 20, 2	2010-07-20
Methods for thinning semiconductor substrates that employ support structures formed on the substrates Grant 7,713,841 - Wood , et al. May 11, 2	2010-05-11
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,709,776 - Farnworth , et al. May 4, 2	2010-05-04
Through-wafer interconnects for photoimager and memory wafers Grant 7,683,458 - Akram , et al. March 23, 2	2010-03-23
Microelectronic Devices And Methods For Forming Interconnects In Microelectronic Devices App 20090191701 - Kirby; Kyle K. ; et al.	2009-07-30
Microelectronic Imagers With Optical Devices And Methods Of Manufacturing Such Microelectronic Imagers App 20090155949 - Farnworth; Warren M. ; et al.	2009-06-18
Microelectronic devices and methods for forming interconnects in microelectronic devices Grant 7,531,453 - Kirby , et al. May 12, 2	2009-05-12
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,504,615 - Farnworth , et al. March 17, 2	2009-03-17
Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level Grant 7,452,743 - Oliver , et al. November 18, 2	2008-11-18
Microelectronic imagers and methods of packaging microelectronic imagers Grant 7,419,841 - Farnworth , et al. September 2, 2	2008-09-02
Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices Grant 7,413,979 - Rigg , et al. August 19, 2	2008-08-19
Microelectronic Devices And Methods For Forming Interconnects In Microelectronic Devices App 20080138973 - Kirby; Kyle K. ; et al.	2008-06-12
Microelectronic devices and methods for forming interconnects in microelectronic devices Grant 7,329,943 - Kirby , et al. February 12, 2	2008-02-12
Methods Of Forming Blind Wafer Interconnects, And Related Structures And Assemblies App 20070257373 - Akram; Salman ; et al.	2007-11-08
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,265,330 - Farnworth , et al. September 4, 2	2007-09-04
Prefabricated housings for microelectronic imagers Grant 7,262,405 - Farnworth , et al. August 28, 2	2007-08-28
Methods for fabricating and filling conductive vias and conductive vias so formed App 20070184654 - Akram; Salman ; et al.	2007-08-09
Methods for packaging microelectronic imagers Grant 7,253,390 - Farnworth , et al. August 7, 2	2007-08-07
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers App 20070170350 - Farnworth; Warren M. ; et al.	2007-07-26
Microelectronic devices and methods for forming interconnects in microelectronic devices Grant 7,232,754 - Kirby , et al. June 19, 2	2007-06-19
Microelectronic imagers and methods of packaging microelectronic imagers Grant 7,199,439 - Farnworth , et al. April 3, 2	2007-04-03
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,189,954 - Farnworth , et al. March 13, 2	2007-03-13
Methods of forming blind wafer interconnects, and related structures and assemblies App 20070045780 - Akram; Salman ; et al.	2007-03-01
Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level App 20070045632 - Oliver; Steven D. ; et al.	2007-03-01
Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices App 20060264041 - Rigg; Sidney B. ; et al.	2006-11-23
Microelectronic imagers and methods of packaging microelectronic imagers App 20060261340 - Farnworth; Warren M. ; et al.	2006-11-23
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers App 20060243889 - Farnworth; Warren M. ; et al.	2006-11-02
Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices App 20060216862 - Rigg; Sidney B. ; et al.	2006-09-28
Microelectronic devices and methods for forming interconnects in microelectronic devices App 20060199363 - Kirby; Kyle K. ; et al.	2006-09-07
Methods for packaging microelectronic imagers App 20060186317 - Farnworth; Warren M. ; et al.	2006-08-24
Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices Grant 7,091,124 - Rigg , et al. August 15, 2	2006-08-15
Microelectronic workpieces and methods for forming interconnects in microelectronic workpieces App 20060177999 - Hembree; David R. ; et al.	2006-08-10
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers App 20060011809 - Farnworth; Warren M. ; et al.	2006-01-19
Materials for use in programmed material consolidation processes App 20060008739 - Wood; Alan G. ; et al.	2006-01-12
Assemblies including semiconductor substrates of reduced thickness and support structures therefor App 20060003549 - Wood; Alan G. ; et al.	2006-01-05
Methods for optimizing physical characteristics of selectively consolidatable materials App 20060003255 - Wood; Alan G. ; et al.	2006-01-05
Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates App 20060001139 - Wood; Alan G. ; et al.	2006-01-05
Microelectronic devices and methods for forming interconnects in microelectronic devices App 20050287783 - Kirby, Kyle K. ; et al.	2005-12-29
Prefabricated housings for microelectronic imagers and methods for packaging microelectronic imagers App 20050275051 - Farnworth, Warren M. ; et al.	2005-12-15
Microelectronic imagers and methods of packaging microelectronic imagers App 20050275048 - Farnworth, Warren M. ; et al.	2005-12-15
Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices App 20050104228 - Rigg, Sidney B. ; et al.	2005-05-19
Support structure for thinning semiconductor substrates and thinning methods employing the support structure App 20050064681 - Wood, Alan G. ; et al.	2005-03-24
Chemical mechanical polishing methods App 20010005666 - Joslyn, Michael J. ; et al.	2001-06-28
Chemical mechanical polishing methods Grant 6,203,404 - Joslyn , et al. March 20, 2	2001-03-20

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.