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Riemersma; Coenraad E. Patent Filings

Riemersma; Coenraad E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Riemersma; Coenraad E..The latest application filed is for "dynamic laminating method and apparatus for ultrasonically bonding juxtaposed webs".

Company Profile
0.6.0
  • Riemersma; Coenraad E. - Cincinnati OH
  • Riemersma; Coenraad E. - Springfield Township Hamilton County
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Dynamic laminating method and apparatus for ultrasonically bonding juxtaposed webs
Grant 4,404,052 - Persson , et al. September 13, 1
1983-09-13
Dynamic ultrasonic laminating apparatus having post-bonding pressure roll, and concomitant method
Grant 4,400,227 - Riemersma August 23, 1
1983-08-23
Apparatus for embossing and perforating a running ribbon of thermoplastic film on a metallic pattern roll
Grant 4,319,868 - Riemersma , et al. March 16, 1
1982-03-16
Method for embossing and perforating a running ribbon of thermoplastic film on a metallic pattern roll
Grant 4,272,473 - Riemersma , et al. June 9, 1
1981-06-09
Web Splicing, Unwinding And Forwarding Apparatus
Grant 3,836,089 - Riemersma September 17, 1
1974-09-17
Dynamic Stress-strain Testing Of Ribbons Of Film
Grant 3,674,221 - Riemersma July 4, 1
1972-07-04

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