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name:-0.0067510604858398
name:-0.0094048976898193
name:-0.00049519538879395
Riege; Jens A. Patent Filings

Riege; Jens A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Riege; Jens A..The latest application filed is for "apparatus and methods for uniform metal plating".

Company Profile
0.8.4
  • Riege; Jens A. - Ojai CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Fixtures and methods for unbonding wafers by shear force
Grant 8,758,553 - Riege , et al. June 24, 2
2014-06-24
Methods of evaporating metal onto a semiconductor wafer in a test wafer holder
Grant 8,481,344 - Luu , et al. July 9, 2
2013-07-09
Apparatus and methods for uniform metal plating
Grant 8,415,770 - Riege , et al. April 9, 2
2013-04-09
Apparatus And Methods For Uniform Metal Plating
App 20120211888 - Riege; Jens A. ;   et al.
2012-08-23
Apparatus and method for uniform metal plating
Grant 8,188,575 - Riege , et al. May 29, 2
2012-05-29
Fixtures And Methods For Unbonding Wafers By Shear Force
App 20120080150 - Riege; Jens A. ;   et al.
2012-04-05
Methods Of Evaporating Metal Onto A Semiconductor Wafer In A Test Wafer Holder
App 20120083118 - Luu; Lam T. ;   et al.
2012-04-05
Apparatus And Method For Uniform Metal Plating
App 20120080790 - Riege; Jens A. ;   et al.
2012-04-05
Apparatus and methods for evaporation including test wafer holder
Grant 8,022,448 - Luu , et al. September 20, 2
2011-09-20

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