loadpatents
name:-0.01380181312561
name:-0.02019190788269
name:-0.00044608116149902
Ridley; Jeffrey A. Patent Filings

Ridley; Jeffrey A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ridley; Jeffrey A..The latest application filed is for "integral topside vacuum package".

Company Profile
0.18.10
  • Ridley; Jeffrey A. - Shorewood MN
  • Ridley; Jeffrey A. - Burnsville MN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Integral topside vacuum package
Grant 8,188,561 - Higashi , et al. May 29, 2
2012-05-29
Integral Topside Vacuum Package
App 20110070401 - Higashi; Robert E. ;   et al.
2011-03-24
Integral topside vacuum package
Grant 7,875,944 - Higashi , et al. January 25, 2
2011-01-25
Shell flow sensor
Grant 7,549,206 - Higashi , et al. June 23, 2
2009-06-23
Shell flow sensor
App 20090044620 - Higashi; Robert E. ;   et al.
2009-02-19
Method for reducing harmonic distortion in comb drive devices
Grant 7,396,476 - Ridley , et al. July 8, 2
2008-07-08
Methods and systems for providing MEMS devices with a top cap and upper sense plate
Grant 7,396,698 - Horning , et al. July 8, 2
2008-07-08
Integral Topside Vacuum Package
App 20080017944 - Higashi; Robert E. ;   et al.
2008-01-24
Integral topside vacuum package
Grant 7,276,798 - Higashi , et al. October 2, 2
2007-10-02
Method for making a wafer-pair having sealed chambers
Grant RE39,143 - Wood , et al. June 27, 2
2006-06-27
Method For Reducing Harmonic Distortion In Comb Drive Devices
App 20060113644 - Ridley; Jeffrey A. ;   et al.
2006-06-01
Methods and systems for providing MEMS devices with a top cap and upper sense plate
App 20060110854 - Horning; Robert D. ;   et al.
2006-05-25
Method for reducing harmonic distortion in comb drive devices
Grant 7,012,322 - Ridley , et al. March 14, 2
2006-03-14
Methods and systems for providing MEMS devices with a top cap and upper sense plate
Grant 7,005,732 - Horning , et al. February 28, 2
2006-02-28
Methods and systems for buried electrical feedthroughs in a glass-silicon MEMS process
Grant 6,924,165 - Horning , et al. August 2, 2
2005-08-02
Method for reducing harmonic distortion in comb drive devices
App 20050136621 - Ridley, Jeffrey A. ;   et al.
2005-06-23
Systems for buried electrical feedthroughs in a glass-silicon MEMS process
Grant 6,888,233 - Horning , et al. May 3, 2
2005-05-03
Methods and systems for providing MEMS devices with a top cap and upper sense plate
App 20050084998 - Horning, Robert D. ;   et al.
2005-04-21
Methods and systems for buried electrical feedthroughs in a glass-silicon MEMS process
App 20040244484 - Horning, Robert D. ;   et al.
2004-12-09
Methods And Systems For Buried Electrical Feedthroughs In A Glass-silicon Mems Process
App 20040180464 - Horning, Robert D. ;   et al.
2004-09-16
Integral topside vacuum package
App 20040140570 - Higashi, Robert E. ;   et al.
2004-07-22
Wafer-pair having deposited layer sealed chambers
Grant 6,359,333 - Wood , et al. March 19, 2
2002-03-19
Dual wafer attachment process
Grant 6,287,940 - Cole , et al. September 11, 2
2001-09-11
Method for making a wafer-pair having sealed chambers
Grant 6,036,872 - Wood , et al. March 14, 2
2000-03-14
Integrated silicon vacuum micropackage for infrared devices
Grant 5,895,233 - Higashi , et al. April 20, 1
1999-04-20
Thin film orthogonal microsensor for air flow and method
Grant 4,914,742 - Higashi , et al. April 3, 1
1990-04-03
Method for making thin film orthogonal microsensor for air flow
Grant 4,895,616 - Higashi , et al. January 23, 1
1990-01-23
Integrated thin-film diaphragm; backside etch
Grant 4,784,721 - Holmen , et al. November 15, 1
1988-11-15

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