loadpatents
Patent applications and USPTO patent grants for Ridley; Jeffrey A..The latest application filed is for "integral topside vacuum package".
Patent | Date |
---|---|
Integral topside vacuum package Grant 8,188,561 - Higashi , et al. May 29, 2 | 2012-05-29 |
Integral Topside Vacuum Package App 20110070401 - Higashi; Robert E. ;   et al. | 2011-03-24 |
Integral topside vacuum package Grant 7,875,944 - Higashi , et al. January 25, 2 | 2011-01-25 |
Shell flow sensor Grant 7,549,206 - Higashi , et al. June 23, 2 | 2009-06-23 |
Shell flow sensor App 20090044620 - Higashi; Robert E. ;   et al. | 2009-02-19 |
Method for reducing harmonic distortion in comb drive devices Grant 7,396,476 - Ridley , et al. July 8, 2 | 2008-07-08 |
Methods and systems for providing MEMS devices with a top cap and upper sense plate Grant 7,396,698 - Horning , et al. July 8, 2 | 2008-07-08 |
Integral Topside Vacuum Package App 20080017944 - Higashi; Robert E. ;   et al. | 2008-01-24 |
Integral topside vacuum package Grant 7,276,798 - Higashi , et al. October 2, 2 | 2007-10-02 |
Method for making a wafer-pair having sealed chambers Grant RE39,143 - Wood , et al. June 27, 2 | 2006-06-27 |
Method For Reducing Harmonic Distortion In Comb Drive Devices App 20060113644 - Ridley; Jeffrey A. ;   et al. | 2006-06-01 |
Methods and systems for providing MEMS devices with a top cap and upper sense plate App 20060110854 - Horning; Robert D. ;   et al. | 2006-05-25 |
Method for reducing harmonic distortion in comb drive devices Grant 7,012,322 - Ridley , et al. March 14, 2 | 2006-03-14 |
Methods and systems for providing MEMS devices with a top cap and upper sense plate Grant 7,005,732 - Horning , et al. February 28, 2 | 2006-02-28 |
Methods and systems for buried electrical feedthroughs in a glass-silicon MEMS process Grant 6,924,165 - Horning , et al. August 2, 2 | 2005-08-02 |
Method for reducing harmonic distortion in comb drive devices App 20050136621 - Ridley, Jeffrey A. ;   et al. | 2005-06-23 |
Systems for buried electrical feedthroughs in a glass-silicon MEMS process Grant 6,888,233 - Horning , et al. May 3, 2 | 2005-05-03 |
Methods and systems for providing MEMS devices with a top cap and upper sense plate App 20050084998 - Horning, Robert D. ;   et al. | 2005-04-21 |
Methods and systems for buried electrical feedthroughs in a glass-silicon MEMS process App 20040244484 - Horning, Robert D. ;   et al. | 2004-12-09 |
Methods And Systems For Buried Electrical Feedthroughs In A Glass-silicon Mems Process App 20040180464 - Horning, Robert D. ;   et al. | 2004-09-16 |
Integral topside vacuum package App 20040140570 - Higashi, Robert E. ;   et al. | 2004-07-22 |
Wafer-pair having deposited layer sealed chambers Grant 6,359,333 - Wood , et al. March 19, 2 | 2002-03-19 |
Dual wafer attachment process Grant 6,287,940 - Cole , et al. September 11, 2 | 2001-09-11 |
Method for making a wafer-pair having sealed chambers Grant 6,036,872 - Wood , et al. March 14, 2 | 2000-03-14 |
Integrated silicon vacuum micropackage for infrared devices Grant 5,895,233 - Higashi , et al. April 20, 1 | 1999-04-20 |
Thin film orthogonal microsensor for air flow and method Grant 4,914,742 - Higashi , et al. April 3, 1 | 1990-04-03 |
Method for making thin film orthogonal microsensor for air flow Grant 4,895,616 - Higashi , et al. January 23, 1 | 1990-01-23 |
Integrated thin-film diaphragm; backside etch Grant 4,784,721 - Holmen , et al. November 15, 1 | 1988-11-15 |
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