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Patent applications and USPTO patent grants for Richter; Franz.The latest application filed is for "method for separating a layer system comprising a wafer".
Patent | Date |
---|---|
Method for separating a layer system comprising a wafer by precisely maintaining the position of the separating front Grant 8,951,886 - Richter February 10, 2 | 2015-02-10 |
Bonding method Grant 8,641,859 - Richter February 4, 2 | 2014-02-04 |
Method For Separating A Layer System Comprising A Wafer App 20120028438 - Richter; Franz | 2012-02-02 |
Bonding Method App 20110272092 - Richter; Franz | 2011-11-10 |
High temperature fuel cell Grant 6,667,126 - Landes , et al. December 23, 2 | 2003-12-23 |
Device for generating X-radiation with a plasma source Grant 5,023,897 - Neff , et al. June 11, 1 | 1991-06-11 |
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