Richling; Wayne Patrick
Patent Applications and Registrations
Patent applications and USPTO patent grants for Richling; Wayne Patrick.The latest application filed is for "trace design to minimize electromigration damage to solder bumps".
- Richling; Wayne Patrick - Ft. Collins CO
| Patent | Date |
|---|---|
| Trace design to minimize electromigration damage to solder bumps Grant 7,253,528 - Dauksher , et al. August 7, 2 | 2007-08-07 |
| Routing design to minimize electromigration damage to solder bumps Grant 7,208,843 - Richling , et al. April 24, 2 | 2007-04-24 |
| Trace design to minimize electromigration damage to solder bumps App 20060186539 - Dauksher; Walter John ; et al. | 2006-08-24 |
| Routing design to minimize electromigration damage to solder bumps App 20060170100 - Richling; Wayne Patrick ; et al. | 2006-08-03 |
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