loadpatents
name:-0.014174938201904
name:-0.014607191085815
name:-0.0023479461669922
Richard; Glen E Patent Filings

Richard; Glen E

Patent Applications and Registrations

Patent applications and USPTO patent grants for Richard; Glen E.The latest application filed is for "separation of integrated circuit structure from adjacent chip".

Company Profile
2.19.18
  • Richard; Glen E - Burlington VT
  • Richard; Glen E. - Essex Junction VT
  • Richard; Glen E. - Burlington VT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Separation of integrated circuit structure from adjacent chip
Grant 10,256,204 - Richard , et al.
2019-04-09
Chip joining by induction heating
Grant 10,245,667 - Ayotte , et al.
2019-04-02
Method for semiconductor die removal rework
Grant 10,050,012 - Ayotte , et al. August 14, 2
2018-08-14
Separation Of Integrated Circuit Structure From Adjacent Chip
App 20180130733 - Richard; Glen E. ;   et al.
2018-05-10
Chip Joining By Induction Heating
App 20170312841 - Ayotte; Stephen P. ;   et al.
2017-11-02
Chip joining by induction heating
Grant 9,776,270 - Ayotte , et al. October 3, 2
2017-10-03
Visually detecting electrostatic discharge events
Grant 9,711,422 - Ayotte , et al. July 18, 2
2017-07-18
Semiconductor Structure And Method Of Making
App 20170200699 - Ayotte; Stephen P. ;   et al.
2017-07-13
Semiconductor structure and method of making
Grant 9,704,830 - Ayotte , et al. July 11, 2
2017-07-11
Method And Structure For Semiconductor Die Removal Rework
App 20170148762 - Ayotte; Stephen P. ;   et al.
2017-05-25
Reliability monitor test strategy definition
Grant 9,645,573 - Ayotte , et al. May 9, 2
2017-05-09
Induction Heating For Underfill Removal And Chip Rework
App 20160372444 - Ayotte; Stephen P. ;   et al.
2016-12-22
Induction heating for underfill removal and chip rework
Grant 9,508,680 - Ayotte , et al. November 29, 2
2016-11-29
IC structure with recessed solder bump area and methods of forming same
Grant 9,472,490 - Sullivan , et al. October 18, 2
2016-10-18
Reliability Monitor Test Strategy Definition
App 20160147220 - Ayotte; Stephen P. ;   et al.
2016-05-26
Visually Detecting Electrostatic Discharge Events
App 20150355253 - Ayotte; Stephen P. ;   et al.
2015-12-10
Solder bump reflow by induction heating
Grant 9,190,375 - Ayotte , et al. November 17, 2
2015-11-17
Reducing thermal energy transfer during chip-join processing
Grant 9,177,931 - Ayotte , et al. November 3, 2
2015-11-03
Solder Bump Reflow By Induction Heating
App 20150294948 - Ayotte; Stephen P. ;   et al.
2015-10-15
Reducing Thermal Energy Transfer During Chip-join Processing
App 20150243618 - Ayotte; Stephen P. ;   et al.
2015-08-27
Visually detecting electrostatic discharge events
Grant 9,105,573 - Ayotte , et al. August 11, 2
2015-08-11
Inhibiting propagation of imperfections in semiconductor devices
Grant 9,059,097 - Ayotte , et al. June 16, 2
2015-06-16
Chip Joining By Induction Heating
App 20150089805 - Ayotte; Stephen P. ;   et al.
2015-04-02
Controlled collapse chip connection (C4) structure and methods of forming
Grant 8,765,593 - Ayotte , et al. July 1, 2
2014-07-01
Controlled Collapse Chip Connection (c4) Structure And Methods Of Forming
App 20140042630 - Ayotte; Stephen P. ;   et al.
2014-02-13
Inhibiting Propagation Of Imperfections In Semiconductor Devices
App 20140042594 - Ayotte; Stephen P. ;   et al.
2014-02-13
Visually Detecting Electrostatic Discharge Events
App 20130257624 - AYOTTE; Stephen P. ;   et al.
2013-10-03
Internal cache for on chip test data storage
Grant 6,901,542 - Bartenstein , et al. May 31, 2
2005-05-31
Incremental fault dictionary
Grant 6,675,323 - Bartenstein , et al. January 6, 2
2004-01-06
Incremental fault dictionary
App 20030046608 - Bartenstein, Thomas W. ;   et al.
2003-03-06
Internal cache for on chip test data storage
App 20030033566 - Bartenstein, Thomas W. ;   et al.
2003-02-13

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