loadpatents
Patent applications and USPTO patent grants for Richard; Glen E.The latest application filed is for "separation of integrated circuit structure from adjacent chip".
Patent | Date |
---|---|
Separation of integrated circuit structure from adjacent chip Grant 10,256,204 - Richard , et al. | 2019-04-09 |
Chip joining by induction heating Grant 10,245,667 - Ayotte , et al. | 2019-04-02 |
Method for semiconductor die removal rework Grant 10,050,012 - Ayotte , et al. August 14, 2 | 2018-08-14 |
Separation Of Integrated Circuit Structure From Adjacent Chip App 20180130733 - Richard; Glen E. ;   et al. | 2018-05-10 |
Chip Joining By Induction Heating App 20170312841 - Ayotte; Stephen P. ;   et al. | 2017-11-02 |
Chip joining by induction heating Grant 9,776,270 - Ayotte , et al. October 3, 2 | 2017-10-03 |
Visually detecting electrostatic discharge events Grant 9,711,422 - Ayotte , et al. July 18, 2 | 2017-07-18 |
Semiconductor Structure And Method Of Making App 20170200699 - Ayotte; Stephen P. ;   et al. | 2017-07-13 |
Semiconductor structure and method of making Grant 9,704,830 - Ayotte , et al. July 11, 2 | 2017-07-11 |
Method And Structure For Semiconductor Die Removal Rework App 20170148762 - Ayotte; Stephen P. ;   et al. | 2017-05-25 |
Reliability monitor test strategy definition Grant 9,645,573 - Ayotte , et al. May 9, 2 | 2017-05-09 |
Induction Heating For Underfill Removal And Chip Rework App 20160372444 - Ayotte; Stephen P. ;   et al. | 2016-12-22 |
Induction heating for underfill removal and chip rework Grant 9,508,680 - Ayotte , et al. November 29, 2 | 2016-11-29 |
IC structure with recessed solder bump area and methods of forming same Grant 9,472,490 - Sullivan , et al. October 18, 2 | 2016-10-18 |
Reliability Monitor Test Strategy Definition App 20160147220 - Ayotte; Stephen P. ;   et al. | 2016-05-26 |
Visually Detecting Electrostatic Discharge Events App 20150355253 - Ayotte; Stephen P. ;   et al. | 2015-12-10 |
Solder bump reflow by induction heating Grant 9,190,375 - Ayotte , et al. November 17, 2 | 2015-11-17 |
Reducing thermal energy transfer during chip-join processing Grant 9,177,931 - Ayotte , et al. November 3, 2 | 2015-11-03 |
Solder Bump Reflow By Induction Heating App 20150294948 - Ayotte; Stephen P. ;   et al. | 2015-10-15 |
Reducing Thermal Energy Transfer During Chip-join Processing App 20150243618 - Ayotte; Stephen P. ;   et al. | 2015-08-27 |
Visually detecting electrostatic discharge events Grant 9,105,573 - Ayotte , et al. August 11, 2 | 2015-08-11 |
Inhibiting propagation of imperfections in semiconductor devices Grant 9,059,097 - Ayotte , et al. June 16, 2 | 2015-06-16 |
Chip Joining By Induction Heating App 20150089805 - Ayotte; Stephen P. ;   et al. | 2015-04-02 |
Controlled collapse chip connection (C4) structure and methods of forming Grant 8,765,593 - Ayotte , et al. July 1, 2 | 2014-07-01 |
Controlled Collapse Chip Connection (c4) Structure And Methods Of Forming App 20140042630 - Ayotte; Stephen P. ;   et al. | 2014-02-13 |
Inhibiting Propagation Of Imperfections In Semiconductor Devices App 20140042594 - Ayotte; Stephen P. ;   et al. | 2014-02-13 |
Visually Detecting Electrostatic Discharge Events App 20130257624 - AYOTTE; Stephen P. ;   et al. | 2013-10-03 |
Internal cache for on chip test data storage Grant 6,901,542 - Bartenstein , et al. May 31, 2 | 2005-05-31 |
Incremental fault dictionary Grant 6,675,323 - Bartenstein , et al. January 6, 2 | 2004-01-06 |
Incremental fault dictionary App 20030046608 - Bartenstein, Thomas W. ;   et al. | 2003-03-06 |
Internal cache for on chip test data storage App 20030033566 - Bartenstein, Thomas W. ;   et al. | 2003-02-13 |
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