Rhyner; Kenneth Robert

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rhyner; Kenneth Robert.The latest application filed is for "millimeter wave integrated circuit with ball grid array package including transmit and receive channels".

Company Profile

1.6.7

Rhyner; Kenneth Robert - Rockwall TX
Rhyner; Kenneth Robert - Roclwall TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Millimeter wave integrated circuit with ball grid array package including transmit and receive channels Grant 10,262,957 - Murugan , et al.	2019-04-16
Millimeter Wave Integrated Circuit With Ball Grid Array Package Including Transmit And Receive Channels App 20180301428 - Murugan; Rajen Manicon ; et al.	2018-10-18
Millimeter wave integrated circuit with ball grid array package including transmit and receive channels Grant 9,941,228 - Murugan , et al. April 10, 2	2018-04-10
Millimeter Wave Integrated Circuit With Ball Grid Array Package Including Transmit And Receive Channels App 20170229408 - MURUGAN; Rajen Manicon ; et al.	2017-08-10
Millimeter wave integrated circuit with ball grid array package including transmit and receive channels Grant 9,666,553 - Murugan , et al. May 30, 2	2017-05-30
Millimeter Wave Integrated Circuit With Ball Grid Array Package Including Transmit And Receive Channels App 20150364816 - MURUGAN; Rajen Manicon ; et al.	2015-12-17
Method of forming an integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad Grant 8,828,799 - Rhyner , et al. September 9, 2	2014-09-09
Integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad Grant 8,598,048 - Rhyner , et al. December 3, 2	2013-12-03
Method of Forming an Integrated Circuit Package Including a Direct Connect Pad, A Blind Via, and a Bond Pad Electrically Coupled to the Direct Connect Pad App 20130295722 - Rhyner; Kenneth Robert ; et al.	2013-11-07
Integrated Circuit Package Including A Direct Connect Pad, A Blind Via, And A Bond Pad Electrically Coupled To The Direct Connect Pad App 20130026642 - Rhyner; Kenneth Robert ; et al.	2013-01-31

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