Rhodenizer; Harold L.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Rhodenizer; Harold L..The latest application filed is for "catalyst solutions for activating non-conductive substrates and electroless plating process".
- Rhodenizer; Harold L. - Bethlehem CT
| Patent | Date |
|---|---|
| Catalyst solutions for activating non-conductive substrates and electroless plating process Grant 4,863,758 - Rhodenizer September 5, 1 | 1989-09-05 |
| Process for preparing printed circuit board thru-holes Grant 4,756,930 - Kukanskis , et al. * July 12, 1 | 1988-07-12 |
| Process for preparing printed circuit board thru-holes Grant 4,597,988 - Kukanskis , et al. July 1, 1 | 1986-07-01 |
| Process of preparing thermoset resin substrates to improve adherence of electrolessly plated metal deposits Grant 4,110,147 - Grunwald , et al. August 29, 1 | 1978-08-29 |
| Method Of Making Additive Printed Circuit Boards Grant 3,854,973 - Mersereau , et al. December 17, 1 | 1974-12-17 |
| Electroless And Electrolytic Copper Plating Grant 3,819,497 - Grunwald , et al. June 25, 1 | 1974-06-25 |
| Aluminum-clad Plastic Substrate Laminates Grant 3,784,440 - Grunwald , et al. January 8, 1 | 1974-01-08 |
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