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Patent applications and USPTO patent grants for Rhine; David B..The latest application filed is for "fluid ejection chip including hydrophilic and hydrophopic surfaces and methods of forming the same".
Patent | Date |
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Fluid ejection chip including hydrophilic and hydrophopic surfaces and methods of forming the same Grant 9,701,119 - Graham , et al. July 11, 2 | 2017-07-11 |
Fluid Ejection Chip Including Hydrophilic And Hydrophopic Surfaces And Methods Of Forming The Same App 20150360466 - Graham; David C. ;   et al. | 2015-12-17 |
Multiple layer etch stop and etching method Grant 7,344,994 - Krawczyk , et al. March 18, 2 | 2008-03-18 |
Multiple layer etch stop and etching method App 20060189144 - Krawczyk; John W. ;   et al. | 2006-08-24 |
Fluidic pump Grant 6,793,462 - Smekal , et al. September 21, 2 | 2004-09-21 |
Microfluidic devices having embedded metal conductors and methods of fabricating said devices Grant 6,787,339 - Rhine , et al. September 7, 2 | 2004-09-07 |
Fluidic pump App 20040018095 - Smekal, Thomas J. ;   et al. | 2004-01-29 |
Solder or brazing barrier Grant 5,051,811 - Williams , et al. September 24, 1 | 1991-09-24 |
Method of creating solder or brazing barriers Grant 4,827,610 - Williams , et al. May 9, 1 | 1989-05-09 |
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