Reynoso; Dexter
Patent Applications and Registrations
Patent applications and USPTO patent grants for Reynoso; Dexter.The latest application filed is for "molded semiconductor package with high voltage isolation".
- Reynoso; Dexter - Singapore SG
| Patent | Date |
|---|---|
| Molded Semiconductor Package With High Voltage Isolation App 20220278060 - Wan; Shao Ping ; et al. | 2022-09-01 |
| Molded Semiconductor Package With High Voltage Isolation App 20220181280 - Wan; Shao Ping ; et al. | 2022-06-09 |
| Molded semiconductor package with high voltage isolation Grant 11,355,460 - Wan , et al. June 7, 2 | 2022-06-07 |
| Multi-clip structure for die bonding Grant 11,189,592 - Upendra , et al. November 30, 2 | 2021-11-30 |
| Multi-Clip Structure for Die Bonding App 20200105707 - Upendra; Balehithlu Manjappaiah ; et al. | 2020-04-02 |
| Semiconductor Package With Wedge Bonded Chip App 20100181675 - Reynoso; Dexter ; et al. | 2010-07-22 |
| Ground land for singulated ball grid array Grant 6,597,188 - Reynoso , et al. July 22, 2 | 2003-07-22 |
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