Reynolds; Tracy

Patent Applications and Registrations

Patent applications and USPTO patent grants for Reynolds; Tracy.The latest application filed is for "virus like vesicles (vlvs) based vaccines to prevent or treat chronic hepatitis b virus (hbv) infection".

Company Profile

0.7.7

Reynolds; Tracy - New Haven CT
Reynolds; Tracy - Kuna ID
Reynolds; Tracy - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Virus like vesicles (VLVS) based vaccines to prevent or treat chronic hepatitis B virus (HBV) infection Grant 9,987,353 - Robek , et al. June 5, 2	2018-06-05
VIRUS LIKE VESICLES (VLVs) BASED VACCINES TO PREVENT OR TREAT CHRONIC HEPATITIS B VIRUS (HBV) INFECTION App 20170056493 - ROBEK; Michael ; et al.	2017-03-02
Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of a semiconductor device App 20060121650 - Fogal; Rich ; et al.	2006-06-08
Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of semiconductor device Grant 6,991,970 - Fogal , et al. January 31, 2	2006-01-31
Integrated circuit package alignment feature Grant 6,858,453 - Corisis , et al. February 22, 2	2005-02-22
Integrated circuit package alignment feature Grant 6,836,003 - Corisis , et al. December 28, 2	2004-12-28
Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of semiconductor device App 20030045026 - Fogal, Rich ; et al.	2003-03-06
Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies App 20010035451 - Bettinger, Michael ; et al.	2001-11-01
Integrated circuit package alignment feature App 20010011762 - Corisis, David J. ; et al.	2001-08-09
Apparatus and method for providing mechanically pre-formed conductive leads App 20010010944 - Ellis, Ronald W. ; et al.	2001-08-02
Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies App 20010008247 - Bettinger, Michael ; et al.	2001-07-19
Integrated circuit package including lead frame with electrically isolated alignment feature Grant 6,246,108 - Corisis , et al. June 12, 2	2001-06-12
Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies Grant 6,199,743 - Bettinger , et al. March 13, 2	2001-03-13
Integrated circuit package alignment feature Grant 6,048,744 - Corisis , et al. April 11, 2	2000-04-11

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