| Patent | Date |
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Multicomponent Module Design And Fabrication
App 20220308564 - Peterson; Kirk D. ; et al. | 2022-09-29 |
Thin film capacitors for core and adjacent build up layers
Grant 11,388,821 - Arvin , et al. July 12, 2 | 2022-07-12 |
Carrier and integrated memory
Grant 10,892,249 - Arvin , et al. January 12, 2 | 2021-01-12 |
Carrier and integrated memory
Grant 10,840,214 - Arvin , et al. November 17, 2 | 2020-11-17 |
Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance
Grant 10,813,215 - Audet , et al. October 20, 2 | 2020-10-20 |
Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance
Grant 10,806,030 - Audet , et al. October 13, 2 | 2020-10-13 |
Decoupling capacitor stiffener
Grant 10,756,031 - Arvin , et al. A | 2020-08-25 |
Thin Film Capacitors For Core And Adjacent Build Up Layers
App 20200245466 - Kind Code | 2020-07-30 |
Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance
Grant 10,687,420 - Audet , et al. | 2020-06-16 |
Ball grid array and land grid array assemblies fabricated using temporary resist
Grant 10,679,931 - Nah , et al. | 2020-06-09 |
Thin film capacitors for core and adjacent build up layers
Grant 10,660,209 - Arvin , et al. | 2020-05-19 |
Multi terminal capacitor within input output path of semiconductor package interconnect
Grant 10,622,299 - Arvin , et al. | 2020-04-14 |
Carrier and integrated memory
Grant 10,515,929 - Arvin , et al. Dec | 2019-12-24 |
Carrier And Integrated Memory
App 20190378816 - Arvin; Charles L. ; et al. | 2019-12-12 |
Carrier And Integrated Memory
App 20190312010 - Arvin; Charles L. ; et al. | 2019-10-10 |
Carrier And Integrated Memory
App 20190312009 - Arvin; Charles L. ; et al. | 2019-10-10 |
Carrier And Integrated Memory
App 20190312011 - Arvin; Charles L. ; et al. | 2019-10-10 |
Carrier and integrated memory
Grant 10,431,563 - Arvin , et al. O | 2019-10-01 |
Ball Grid Array And Land Grid Array Assemblies Fabricated Using Temporary Resist
App 20190229045 - Nah; Jae-Woong ; et al. | 2019-07-25 |
Multi Terminal Capacitor Within Input Output Path Of Semiconductor Package Interconnect
App 20190172784 - Arvin; Charles L. ; et al. | 2019-06-06 |
Thin Film Capacitors For Core And Adjacent Build Up Layers
App 20190150287 - Arvin; Charles L. ; et al. | 2019-05-16 |
Ball grid array and land grid array assemblies fabricated using temporary resist
Grant 10,249,559 - Nah , et al. | 2019-04-02 |
Multi terminal capacitor within input output path of semiconductor package interconnect
Grant 10,224,274 - Arvin , et al. | 2019-03-05 |
Multi terminal capacitor within input output path of semiconductor package interconnect
Grant 10,224,273 - Arvin , et al. | 2019-03-05 |
Multi Terminal Capacitor Within Input Output Path Of Semiconductor Package Interconnect
App 20180068945 - Arvin; Charles L. ; et al. | 2018-03-08 |
Multi Terminal Capacitor Within Input Output Path Of Semiconductor Package Interconnect
App 20180053717 - Arvin; Charles L. ; et al. | 2018-02-22 |
Multi terminal capacitor within input output path of semiconductor package interconnect
Grant 9,899,313 - Arvin , et al. February 20, 2 | 2018-02-20 |
Multi Terminal Capacitor Within Input Output Path Of Semiconductor Package Interconnect
App 20180012838 - Arvin; Charles L. ; et al. | 2018-01-11 |
Multi-layer Circuit Using Metal Layers As A Moisture Diffusion Barrier For Electrical Performance
App 20160210398 - AUDET; Jean ; et al. | 2016-07-21 |
Multi-layer Circuit Using Metal Layers As A Moisture Diffusion Barrier For Electrical Performance
App 20160211229 - AUDET; Jean ; et al. | 2016-07-21 |
Multi-layer Circuit Using Metal Layers As A Moisture Diffusion Barrier For Electrical Performance
App 20160211481 - AUDET; Jean ; et al. | 2016-07-21 |
Ball Grid Array And Land Grid Array Assemblies Fabricated Using Temporary Resist
App 20160133554 - Nah; Jae-Woong ; et al. | 2016-05-12 |
Ball grid array and land grid array assemblies fabricated using temporary resist
Grant 9,263,378 - Nah , et al. February 16, 2 | 2016-02-16 |
Ball Grid Array And Land Grid Array Assemblies Fabricated Using Temporary Resist
App 20160035659 - Nah; Jae-Woong ; et al. | 2016-02-04 |
Multi-chip module system with removable socketed modules
Grant 8,680,670 - Casey , et al. March 25, 2 | 2014-03-25 |
Multi-chip Module System With Removable Socketed Modules
App 20120098116 - Casey; Jon Alfred ; et al. | 2012-04-26 |
Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend system
Grant 7,932,342 - Molis , et al. April 26, 2 | 2011-04-26 |
Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method
Grant 7,808,099 - Bertrand , et al. October 5, 2 | 2010-10-05 |
Liquid Thermal Interface Having Mixture Of Linearly Structured Polymer Doped Crosslinked Networks And Related Method
App 20090281254 - Bertrand; Randall J. ; et al. | 2009-11-12 |
Method To Improve Wettability By Reducing Liquid Polymer Macromolecule Mobility Through Forming Polymer Blend System
App 20090182161 - MOLIS; Steven E. ; et al. | 2009-07-16 |
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