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Patent applications and USPTO patent grants for Rexius; Kristopher.The latest application filed is for "molded article and composition used in its fabrication".
Patent | Date |
---|---|
Molded Article And Composition Used In Its Fabrication App 20160130438 - Rexius; Kristopher ;   et al. | 2016-05-12 |
Poly(phenylene Ether) Composition And Article App 20140088236 - Ziegler; Christopher ;   et al. | 2014-03-27 |
Poly(phenylene ether) article and composition Grant 8,637,131 - Balfour , et al. January 28, 2 | 2014-01-28 |
Abrasion resistant electrical wire Grant 7,795,537 - Mhetar , et al. September 14, 2 | 2010-09-14 |
Electrical wire and method of making an electrical wire Grant 7,741,564 - Mhetar , et al. June 22, 2 | 2010-06-22 |
Abrasion Resistant Electrical Wire App 20090266576 - Mhetar; Vijay R. ;   et al. | 2009-10-29 |
Electrical Wire and Method of Making an Electrical Wire App 20080289850 - Mhetar; Vijay R. ;   et al. | 2008-11-27 |
Electrical wire and method of making an electrical wire Grant 7,453,044 - Mhetar , et al. November 18, 2 | 2008-11-18 |
Electrical Wire And Method Of Making An Electrical Wire App 20070261877 - Mhetar; Vijay R. ;   et al. | 2007-11-15 |
Electrical wire and method of making an electrical wire Grant 7,220,917 - Mhetar , et al. May 22, 2 | 2007-05-22 |
Covering for conductors Grant 7,217,885 - Mhetar , et al. May 15, 2 | 2007-05-15 |
Abrasion resistant electrical wire Grant 7,217,886 - Mhetar , et al. May 15, 2 | 2007-05-15 |
Abrasion Resistant Electrical Wire App 20060191706 - Mhetar; Vijay R. ;   et al. | 2006-08-31 |
Abrasion resistant electrical wire Grant 7,084,347 - Mhetar , et al. August 1, 2 | 2006-08-01 |
Covering for conductors App 20060131050 - Mhetar; Vijay R. ;   et al. | 2006-06-22 |
Abrasion Resistant Electrical Wire App 20060131051 - Mhetar; Vijay R. ;   et al. | 2006-06-22 |
Electrical wire and method of making an electrical wire App 20060131052 - Mhetar; Vijay R. ;   et al. | 2006-06-22 |
Poly(arylene ether) composition App 20050182170 - Majumdar, Biswaroop ;   et al. | 2005-08-18 |
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