| Patent | Date |
|---|
Termination Feedthrough Unit With Ceramic Insulator For Vacuum And Corrosive Applications
App 20210292246 - ELLIOT; Brent ; et al. | 2021-09-23 |
Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices
Grant 11,091,397 - Elliot , et al. August 17, 2 | 2021-08-17 |
Termination feedthrough unit with ceramic insulator suitable for vacuum and corrosive applications
Grant 11,028,021 - Elliot , et al. June 8, 2 | 2021-06-08 |
High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using same
Grant 10,991,616 - Elliot , et al. April 27, 2 | 2021-04-27 |
High Speed Low Temperature Method For Manufacturing And Repairing Semiconductor Processing Equipment And Equipment Produced Usin
App 20200185262 - Elliot; Alfred Grant ; et al. | 2020-06-11 |
Method for manufacture of a multi-layer plate device
Grant 10,646,941 - Elliot , et al. | 2020-05-12 |
Low Temperature Method For Hermetically Joining Non-Diffusing Ceramic Materials In Multi-Layer Plate Devices
App 20200031725 - Elliot; Alfred Grant ; et al. | 2020-01-30 |
Termination Feedthrough Unit With Ceramic Insulator Suitable For Vacuum And Corrosive Applications
App 20190194078 - Elliot; Brent ; et al. | 2019-06-27 |
Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices
Grant 10,287,215 - Elliot , et al. | 2019-05-14 |
Ceramic Material Assembly For Use In Highly Corrosive Or Erosive Semiconductor Processing Applications
App 20190066980 - Elliot; Brent ; et al. | 2019-02-28 |
Multi-layer plate device
Grant 10,213,858 - Elliot , et al. Feb | 2019-02-26 |
Ceramic Material Assembly For Use In Highly Corrosive Or Erosive Industrial Applications
App 20180354861 - Elliot; Brent ; et al. | 2018-12-13 |
High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using same
Grant 10,153,183 - Elliot , et al. Dec | 2018-12-11 |
Multiple Zone Heater
App 20180277352 - Elliot; Alfred Grant ; et al. | 2018-09-27 |
Multiple zone heater
Grant 9,984,866 - Elliot , et al. May 29, 2 | 2018-05-29 |
Method For Manufacture Of A Multi-Layer Plate Device
App 20170259364 - Elliot; Alfred Grant ; et al. | 2017-09-14 |
Low Temperature Method For Hermetically Joining Non-Diffusing Ceramic Materials In Multi-Layer Plate Devices
App 20170240475 - Elliot; Alfred Grant ; et al. | 2017-08-24 |
Low temperature method for hermetically joining non-diffusing ceramic materials
Grant 9,624,137 - Elliot , et al. April 18, 2 | 2017-04-18 |
Multi-Layer Plate Device
App 20170036285 - Elliot; Alfred Grant ; et al. | 2017-02-09 |
Method for manufacture of a multi-layer plate device
Grant 9,556,074 - Elliot , et al. January 31, 2 | 2017-01-31 |
Multi-layer plate device
Grant 9,315,424 - Elliot , et al. April 19, 2 | 2016-04-19 |
High Speed Low Temperature Method For Manufacturing And Repairing Semiconductor Processing Equipment And Equipment Produced Using Same
App 20150287620 - Elliot; Alfred Grant ; et al. | 2015-10-08 |
Low Temperature Method For Hermetically Joining Non-Diffusing Ceramic Materials
App 20150108203 - Elliot; Alfred Grant ; et al. | 2015-04-23 |
Plate and shaft device
Grant 8,932,690 - Elliot , et al. January 13, 2 | 2015-01-13 |
Hermetically joined ceramic assemblies and low temperature method for hermetically joining ceramic materials
Grant 8,789,743 - Elliot , et al. July 29, 2 | 2014-07-29 |
Method For Manufacture Of A Multi-Layer Plate Device
App 20140197227 - Elliot; Alfred Grant ; et al. | 2014-07-17 |
Method for hermetically joining plate and shaft devices including ceramic materials used in semiconductor processing
Grant 8,684,256 - Elliot , et al. April 1, 2 | 2014-04-01 |
Multiple Zone Heater
App 20140014642 - Elliot; Alfred Grant ; et al. | 2014-01-16 |
Method For Hermetically Joining Ceramic Materials Using Brazing Of Pre-Metallized Regions
App 20140014710 - Elliot; Alfred Grant ; et al. | 2014-01-16 |
Compressible Conductive Element For Use In Current-carrying Structure
App 20130250471 - REX; Dennis George | 2013-09-26 |
Hermetically Joined Ceramic Assemblies And Low Temperature Method For Hermetically Joining Ceramic Materials
App 20130186940 - Elliot; Alfred Grant ; et al. | 2013-07-25 |
Hermetically Joined Plate And Shaft Devices
App 20130189022 - Elliot; Alfred Grant ; et al. | 2013-07-25 |
Multi-Layer Plate Device
App 20130180976 - Elliot; Alfred Grant ; et al. | 2013-07-18 |
Method For Hermetically Joining Plate And Shaft Devices Including Ceramic Materials Used In Semiconductor Processing
App 20130181038 - Elliot; Alfred Grant ; et al. | 2013-07-18 |
High Speed Low Temperature Method For Manufacturing And Repairing Semiconductor Processing Equipment And Equipment Produced Using Same
App 20130136878 - Elliot; Alfred Grant ; et al. | 2013-05-30 |
Electrostatic chuck with dielectric inserts
App 20100177454 - Elliot; Brent ; et al. | 2010-07-15 |
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