Revier; Daniel Lee
Patent Applications and Registrations
Patent applications and USPTO patent grants for Revier; Daniel Lee.The latest application filed is for "thermally conductive wafer layer".
Company Profile
26.20.31
- Revier; Daniel Lee - Dallas TX
- Revier; Daniel Lee - Garland TX
- Revier; Daniel Lee - Seattle WA
- Revier; Daniel Lee - Addison TX
Patent Activity
| Patent | Date |
|---|---|
| 3D printed semiconductor package Grant 11,417,540 - Cook , et al. August 16, 2 | 2022-08-16 |
| Microelectronic device substrate formed by additive process Grant 11,404,270 - Cook , et al. August 2, 2 | 2022-08-02 |
| Thermally Conductive Wafer Layer App 20220208640 - Cook; Benjamin Stassen ; et al. | 2022-06-30 |
| Nanoparticle matrix for backside heat spreading Grant 11,355,414 - Cook , et al. June 7, 2 | 2022-06-07 |
| Molded packaged antenna Grant 11,271,296 - Stiborek , et al. March 8, 2 | 2022-03-08 |
| Nanoparticle Backside Die Adhesion Layer App 20210265299 - Cook; Benjamin Stassen ; et al. | 2021-08-26 |
| Methods And Apparatus For Digital Material Deposition Onto Semiconductor Wafers App 20210200094 - Revier; Daniel Lee ; et al. | 2021-07-01 |
| Nanoparticle backside die adhesion layer Grant 11,031,364 - Cook , et al. June 8, 2 | 2021-06-08 |
| Lens Cleaning Via Electrowetting App 20210157130 - Revier; Daniel Lee ; et al. | 2021-05-27 |
| 3d Printed Semiconductor Package App 20210151551 - Cook; Benjamin Stassen ; et al. | 2021-05-20 |
| Thermal Management in Integrated Circuit Using Phononic Bandgap Structure App 20210151357 - Cook; Benjamin Stassen ; et al. | 2021-05-20 |
| Additive Process For Circular Printing App 20210138727 - Revier; Daniel Lee ; et al. | 2021-05-13 |
| Nanoparticle Matrix For Backside Heat Spreading App 20210098331 - Cook; Benjamin Stassen ; et al. | 2021-04-01 |
| 3d Printed Semiconductor Package App 20210090904 - Cook; Benjamin Stassen ; et al. | 2021-03-25 |
| Lens cleaning via electrowetting Grant 10,908,414 - Revier , et al. February 2, 2 | 2021-02-02 |
| 3D printed semiconductor package Grant 10,910,465 - Cook , et al. February 2, 2 | 2021-02-02 |
| Thermal management in integrated circuit using phononic bandgap structure Grant 10,886,187 - Cook , et al. January 5, 2 | 2021-01-05 |
| Methods And Apparatus For Surface Wetting Control App 20200406316 - Revier; Daniel Lee ; et al. | 2020-12-31 |
| Semiconductor package with liquid metal conductors Grant 10,879,151 - Parekh , et al. December 29, 2 | 2020-12-29 |
| 3D printed semiconductor package Grant 10,861,715 - Cook , et al. December 8, 2 | 2020-12-08 |
| Acoustic management in integrated circuit using phononic bandgap structure Grant 10,833,648 - Revier , et al. November 10, 2 | 2020-11-10 |
| Integrated circuit using photonic bandgap structure Grant 10,788,367 - Cook , et al. September 29, 2 | 2020-09-29 |
| Methods and apparatus for surface wetting control Grant 10,780,467 - Revier , et al. Sept | 2020-09-22 |
| 3d Printed Semiconductor Package App 20200212166 - Cook; Benjamin Stassen ; et al. | 2020-07-02 |
| 3d Printed Semiconductor Package App 20200211862 - Cook; Benjamin Stassen ; et al. | 2020-07-02 |
| Liquid Metal Mems Switch App 20200211798 - Fruehling; Adam Joseph ; et al. | 2020-07-02 |
| Semiconductor Package With Liquid Metal Conductors App 20200211928 - PAREKH; Dishit Paresh ; et al. | 2020-07-02 |
| Microelectronic Device Substrate Formed By Additive Process App 20200176251 - Cook; Benjamin Stassen ; et al. | 2020-06-04 |
| Integrated Circuit Using Photonic Bandgap Structure App 20200141800 - Cook; Benjamin Stassen ; et al. | 2020-05-07 |
| Integrated circuit package with stress directing material Grant 10,622,270 - Cook , et al. | 2020-04-14 |
| Spectrometry in integrated circuit using a photonic bandgap structure Grant 10,557,754 - Cook , et al. Feb | 2020-02-11 |
| Self-assembly of semiconductor die onto a leadframe using magnetic fields Grant 10,553,573 - Revier , et al. Fe | 2020-02-04 |
| Electromagnetic interference shield within integrated circuit encapsulation using photonic bandgap structure Grant 10,497,651 - Cook , et al. De | 2019-12-03 |
| Galvanic signal path isolation in an encapsulated package using a photonic structure Grant 10,444,432 - Cook , et al. Oc | 2019-10-15 |
| Nanoparticle Backside Die Adhesion Layer App 20190279955 - Cook; Benjamin Stassen ; et al. | 2019-09-12 |
| Integrated circuit with dielectric waveguide connector using photonic bandgap structure Grant 10,371,891 - Cook , et al. | 2019-08-06 |
| Additive Photonic Interconnects In Microelectronic Device App 20190204505 - Cook; Benjamin Stassen ; et al. | 2019-07-04 |
| Molded Packaged Antenna App 20190148823 - STIBOREK; Leon ; et al. | 2019-05-16 |
| Spectrometry in Integrated Circuit Using a Photonic Bandgap Structure App 20190128735 - Cook; Benjamin Stassen ; et al. | 2019-05-02 |
| Galvanic Signal Path Isolation in an Encapsulated Package Using a Photonic Structure App 20190131682 - Cook; Benjamin Stassen ; et al. | 2019-05-02 |
| Electromagnetic Interference Shield within Integrated Circuit Encapsulation Using Photonic Bandgap Structure App 20190131250 - Cook; Benjamin Stassen ; et al. | 2019-05-02 |
| Integrated Circuit with Dielectric Waveguide Connector Using Photonic Bandgap Structure App 20190131196 - Cook; Benjamin Stassen ; et al. | 2019-05-02 |
| Thermal Management in Integrated Circuit Using Phononic Bandgap Structure App 20190122947 - Cook; Benjamin Stassen ; et al. | 2019-04-25 |
| Acoustic Management in Integrated Circuit Using Phononic Bandgap Structure App 20190123711 - Revier; Daniel Lee ; et al. | 2019-04-25 |
| Self-assembly of Semiconductor Die onto a Leadframe Using Magnetic Fields App 20190074270 - Revier; Daniel Lee ; et al. | 2019-03-07 |
| Integrated Circuit Package with Stress Directing Material App 20190067139 - Cook; Benjamin Stassen ; et al. | 2019-02-28 |
| Methods and apparatus providing a graded package for a semiconductor Grant 10,170,384 - Revier , et al. J | 2019-01-01 |
| Lens Cleaning Via Electrowetting App 20180326462 - REVIER; Daniel Lee ; et al. | 2018-11-15 |
| Methods And Apparatus For Surface Wetting Control App 20180304318 - Revier; Daniel Lee ; et al. | 2018-10-25 |
| Methods And Apparatus For Electrostatic Control Of Expelled Material For Lens Cleaners App 20180304282 - Cook; Benjamin Stassen ; et al. | 2018-10-25 |
| Methods And Apparatus Providing A Graded Package For A Semiconductor App 20180254230 - Revier; Daniel Lee ; et al. | 2018-09-06 |
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