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Patent applications and USPTO patent grants for Retzlaff; Udo Heinz.The latest application filed is for "mobile, transportable, electrostatic chuck for wafers made of semiconductor material".
Patent | Date |
---|---|
Mobile, transportable, electrostatic chuck for wafers made of semiconductor material Grant 7,652,867 - Retzlaff January 26, 2 | 2010-01-26 |
Transfer-ESC based on a wafer Grant 7,564,672 - Retzlaff July 21, 2 | 2009-07-21 |
Mobile, transportable, electrostatic chuck for wafers made of semiconductor material App 20070258185 - Retzlaff; Udo Heinz | 2007-11-08 |
Transfer-ESC based on a wafer App 20070014073 - Retzlaff; Udo Heinz | 2007-01-18 |
Semiconductor processing article Grant 6,706,205 - Gorczyca , et al. March 16, 2 | 2004-03-16 |
Semiconductor processing article App 20020094686 - Gorczyca, Thomas Bert ;   et al. | 2002-07-18 |
Semiconductor processing article Grant 6,368,410 - Gorczyca , et al. April 9, 2 | 2002-04-09 |
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